Tom Ley

In the United States, there are 46 individuals named Tom Ley spread across 32 states, with the largest populations residing in Ohio, Texas, Wisconsin.

Public information about Tom Ley

Resumes

Co-Owner

Location:

Brooklyn, NY

Work:

Defector Media
Co-Owner

Education:

University of Colorado Boulder 2006 - 2010

Senior Vice President And Portfolio Manager

Location:

New York, NY

Work:

Senior Vice President and Portfolio Manager

Looking For New Opportunities

Location:

Green Bay, Wisconsin Area

Industry:

Information Technology and Services

Work:

CISCO/VERIZON - Phoenix Nov 2012 - Nov 2012
Wireless Network Consultant Georgia-Pacific LLC - Green Bay, Wisconsin May 2012 - Aug 2012
Wireless Consultant Aurora St. Luke's Medical Center - Aurora St. Luke's Oct 2011 - Nov 2011
Epic Go Live Smart Chart “Solution Center” Wire Technologies - Wisconsin Aug 2000 - May 2010
Senior Technical Account Manager Office Technology - Neenah WI Mar 1998 - Jul 2000
Technical Integration Manager

Education:

Milwaukee Area Technical College 2011 - 2011
Certification, Health Information Technology University of Wisconsin-Whitewater 1969 - 1971

Skills:

Healthcare Information Technology, Healthcare IT, EHR, Health Information Exchange, EMR, HIPAA, Software Implementation, Disaster Recovery, Integration, Visio, IT Management, Troubleshooting, Have experience with Crystal Reports, Healthcare, Crystal Reports, AirMagnet, Wireless Site Surveys, Wireless LAN Controller, LWAPP, EAP-TLS, PEAP, Authentication Protocols, WPA, WiSM, Omnipeek, 802.11n, MAC layer, PHY, Interference Cancellation, Beamforming, Smart Antennas, OFDMA

Interests:

Golf, fishing, sailing, travel

Certifications:

Cisco Certified Design Associate CCDA (2008-Present), Cisco
Cisco Sales Expert, Cisco
Cisco Advanced Wireless LAN Sales Specialist, Cisco
Citrix Certified Sales Professional CCSP, Citrix
EMC Sales Professional, EMC
Cisco IP Communications Express Sales Specialist, Cisco
Cisco IP Telephony Account Manager, Cisco

President And Chief Executive Officer

Location:

Madison, WI

Industry:

Construction

Work:

Ley Contracting
President and Chief Executive Officer

Tom Ley

Location:

New York, NY

Industry:

Financial Services

Managing Director - Investments

Location:

12 Bellevue Ave, Rumson, NJ 07760

Work:

Wells Fargo Advisors
Managing Director - Investments

Education:

Villanova University

Tom Ley

Location:

New York, NY

Industry:

Financial Services

Tom Ley

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Phones & Addresses

Name

Addresses

Phones

Tom Ley

521 Hudson St, New York, NY 10014

Tom Ley

9261 River Rd, Waterville, OH 43566

Tom Ley

1847 Ohlsun Ct, La Crosse, WI 54601

608-788-2243

Tom Ley

127 Market St, Elkhorn, WI 53121

Tom Ley

1810 Killian Dr, Kaukauna, WI 54130

Tom Ley

195 Fair St, Okolona, OH 43545

Tom Ley

3303 Beach Ln, Green Bay, WI 54311

Tom Ley

San Jose, CA

408-996-0805

Publications

Us Patents

Semiconductor Device Package With Solder Bump Electrical Connections On An External Surface Of The Package

US Patent:

5249098, Sep 28, 1993

Filed:

Jul 28, 1992

Appl. No.:

7/922118

Inventors:

Michael D. Rostoker - San Jose CA
Tom Ley - Santa Clara CA

Assignee:

LSI Logic Corporation - Milpitas CA

International Classification:

H02B 0000

US Classification:

361600

Abstract:

Wells are formed in an external surface of a semiconductor device package body. Capacitors are disposed within the wells at least partially, and preferably fully within the body. Cleaning channels are formed underneath the capacitors, for removing residual flux and/or solder.

Multi-Layer Semiconductor Package Substrate With Thermally-Conductive Prepeg Layer

US Patent:

5500555, Mar 19, 1996

Filed:

Apr 11, 1994

Appl. No.:

8/225860

Inventors:

Tom Ley - Santa Clara CA

Assignee:

LSI Logic Corporation - Milpitas CA

International Classification:

H01L 23053
H01L 2312
H01L 2314

US Classification:

257700

Abstract:

Improved thermal characteristics are obtained in a multi-layer substrate for mounting a semiconductor device. A prepeg layer disposed in close proximity to or immediately adjacent to a semiconductor device is formed incorporating an integral, thermally-conductive mesh or screen. The prepeg layer is preferably a sandwich structure of two BT-resin layers (films), between which is disposed a copper screen. In this manner, heat is conducted away from an operating device by an integral part of the substrate, without the need for additional slugs or heat sink structures. Utility for multichip modules is also disclosed.

Cool Frame For Protecting Packaged Electronic Devices

US Patent:

6362522, Mar 26, 2002

Filed:

Jul 10, 2000

Appl. No.:

09/612589

Inventors:

Tom Ley - Cupertino CA

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

H01L 2312

US Classification:

257711, 257712, 257713, 257719

Abstract:

An integrated circuit arrangement having an integrated circuit package contains an integrated circuit device mounted to a surface of the package. A flat frame is placed on the package surface and substantially surrounds the device. The flat frame has a central opening that receives the integrated circuit device. The height of the flat frame is relative to the height of the circuit device. A heat sink is mounted to the circuit device such that the bottom of the heat sink contacts the upper surface of the integrated circuit device but, does not contact the flat frame.

Recessed Chip Capacitor Wells With Cleaning Channels On Integrated Circuit Packages

US Patent:

5210683, May 11, 1993

Filed:

Aug 22, 1991

Appl. No.:

7/749128

Inventors:

Tom Ley - Santa Clara CA

Assignee:

LSI Logic Corporation - Milpitas CA

International Classification:

H05K 114

US Classification:

361414

Abstract:

Stiffener Frame With Circuit Board Corner Protection

US Patent:

2013025, Oct 3, 2013

Filed:

Mar 30, 2012

Appl. No.:

13/436177

Inventors:

Tom J. Ley - Cupertino CA, US
Eric S. Tosaya - Fremont CA, US
Chia-Ken Leong - Fremont CA, US

International Classification:

H05K 7/14
H05K 3/00

US Classification:

361753, 29829

Abstract:

Various circuit boards and stiffener frames and methods of making the same are disclosed. In one aspect, a method of manufacturing is provided that includes fabricating a stiffener frame that has a surface adapted to engage a side of a circuit board. The surface includes a projection to protect a corner of the circuit board.

Spring Frame For Protecting Packaged Electronic Devices

US Patent:

6417563, Jul 9, 2002

Filed:

Jul 14, 2000

Appl. No.:

09/617102

Inventors:

Jonathan Halderman - San Jose CA
Mohammad Khan - San Jose CA
Alexander C. Tain - Milpitas CA
Tom Ley - Cupertino CA

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

H05K 720

US Classification:

257718, 257707, 257719, 361719

Abstract:

An integrated circuit arrangement comprising an integrated circuit package having a package board. An integrated circuit die is mounted to a surface of the package board. A spring frame is mounted to the package board surface at a pair of opposite frame bends. The spring frame has a central opening that receives the integrated circuit die. Sides of the spring frame away from the bends are raised from the package surface. A heat sink is mounted to the spring frame such that a bottom of the heat sink contacts an upper surface of the integrated circuit die as the heat sink pushes the sides of the spring frame toward the package surface.

Chip Package With Stiffener Ring

US Patent:

2008028, Nov 20, 2008

Filed:

May 15, 2007

Appl. No.:

11/748618

Inventors:

Eric Tosaya - Fremont CA, US
Jun Zhai - San Jose CA, US
Chia-Ken Leong - Santa Clara CA, US
Tom Ley - Cupertino CA, US

International Classification:

H01L 23/28
H01L 21/00

US Classification:

257787, 438127, 257E23116

Abstract:

Various semiconductor chip packages and methods of making the same are provided. In one aspect, a method of manufacturing is provided that includes providing a substrate that has a first side and a first plurality of passive devices in the first side. A polymeric stiffener ring is formed on the first side. The stiffener ring embeds the first plurality of passive devices without covering a central portion of the first surface of the substrate. A semiconductor chip is mounted on the central portion of the first surface of the substrate.

Heat Sink Grounded To A Grounded Package Lid

US Patent:

6512675, Jan 28, 2003

Filed:

Jan 19, 2001

Appl. No.:

09/764132

Inventors:

Thomas S. Tarter - Campbell CA
Eric S. Tosaya - Fremont CA
Tom J. Ley - Cupertino CA
Shrikar Bhagath - San Jose CA
Nhon T. Do - Mountain View CA

Assignee:

Advanced Micro Devices, Inc. - Sunnyvale CA

International Classification:

H05K 720

US Classification:

361714, 361704, 361707, 257706, 174 151

Abstract:

An intregrated circuit package, which has an intregrated circuit die thereto, is mounted to a system board. The ground trace of the system board is connected to the package, which has a pluality of ground leads on its surface. An electrically conductive epoxy is placed on the ground leads and adheres the package lid to the package board and ground the package lid. A heat sink is mounted to the package lid with an electrically conductive adhesive or electrically conductive slips that extend from a flange of the package lid to a flange of the heat sink to ground the heat sink.

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FAQ: Learn more about Tom Ley

How is Tom Ley also known?

Tom Ley is also known as: Tomas J Ley, Tomas T Ley. These names can be aliases, nicknames, or other names they have used.

Who is Tom Ley related to?

Known relatives of Tom Ley are: Derek Ley, Gabriella Ley, Nicole Ley, Sandra Ley, Sylvia Ley. This information is based on available public records.

What are Tom Ley's alternative names?

Known alternative names for Tom Ley are: Derek Ley, Gabriella Ley, Nicole Ley, Sandra Ley, Sylvia Ley. These can be aliases, maiden names, or nicknames.

What is Tom Ley's current residential address?

Tom Ley's current known residential address is: 1847 Ohlsun Ct, La Crosse, WI 54601. Please note this is subject to privacy laws and may not be current.

What are the previous addresses of Tom Ley?

Previous addresses associated with Tom Ley include: 12034 Sunchase Dr, Jacksonville, FL 32246; 195 Fair, Napoleon, OH 43545; 4733 County, Delta, OH 43515; 4733 County Road C, Delta, OH 43515; 12034 Sunchase, Jacksonville, FL 32246. Remember that this information might not be complete or up-to-date.

Where does Tom Ley live?

Escondido, CA is the place where Tom Ley currently lives.

How old is Tom Ley?

Tom Ley is 68 years old.

What is Tom Ley date of birth?

Tom Ley was born on 1956.

What is Tom Ley's telephone number?

Tom Ley's known telephone numbers are: 608-788-2243, 419-822-5309, 408-768-4433, 734-905-7499, 408-996-0805, 920-469-2824. However, these numbers are subject to change and privacy restrictions.

How is Tom Ley also known?

Tom Ley is also known as: Tomas J Ley, Tomas T Ley. These names can be aliases, nicknames, or other names they have used.

Name Variants	Thomas Ley
Ages	37 to 83
Phones	608-788-2243	419-822-5309	408-768-4433
Addresses	1847 Ohlsun Ct, La Crosse, WI 54601	12034 Sunchase Dr, Jacksonville, FL 32246	195 Fair, Napoleon, OH 43545
Business records	Wireless Network Consultant / CISCO/VERIZON	Account Executive / CEI	Webmaster / Courtesy Nissan Parts Department

Tom Ley

What do we know about Tom Ley

Public information about Tom Ley

Resumes

Resumes

Co-Owner

Senior Vice President And Portfolio Manager

Looking For New Opportunities

President And Chief Executive Officer

Tom Ley

Managing Director - Investments

Tom Ley

Tom Ley

Phones & Addresses

Publications

Us Patents

Semiconductor Device Package With Solder Bump Electrical Connections On An External Surface Of The Package

Multi-Layer Semiconductor Package Substrate With Thermally-Conductive Prepeg Layer

Cool Frame For Protecting Packaged Electronic Devices

Recessed Chip Capacitor Wells With Cleaning Channels On Integrated Circuit Packages

Stiffener Frame With Circuit Board Corner Protection

Spring Frame For Protecting Packaged Electronic Devices

Chip Package With Stiffener Ring

Heat Sink Grounded To A Grounded Package Lid

FAQ: Learn more about Tom Ley

Possible Relatives

Tom Ley from other States