Login about (844) 217-0978

Roderick Davies

In the United States, there are 46 individuals named Roderick Davies spread across 20 states, with the largest populations residing in Florida, Utah, Arizona. These Roderick Davies range in age from 42 to 89 years old. Some potential relatives include Joseph Lanza, David Davis, Bunyan Davis. You can reach Roderick Davies through various email addresses, including lori***@earthlink.net, blkpan***@cox.net, roderickhbdav***@yahoo.com. The associated phone number is 319-895-8973, along with 6 other potential numbers in the area codes corresponding to 801, 702, 650. For a comprehensive view, you can access contact details, phone numbers, addresses, emails, social media profiles, arrest records, photos, videos, public records, business records, resumes, CVs, work history, and related names to ensure you have all the information you need.

Public information about Roderick Davies

Resumes

Resumes

Roderick Davies

Roderick Davies Photo 1
Location:
Provo, Utah Area
Industry:
Consumer Goods

Roderick D Davies - Pleasant Grove, UT

Roderick Davies Photo 2
Work:
EasternPro (HK) Limited Jan 2007 to 2000
Director of Operations Romney for President campaign - Boston, MA Jan 2006 to Mar 2008
National Finance The Lifelike Company - Denver, CO Dec 1999 to Nov 2006
Vice President
Education:
University of Michigan - Ann Arbor, MI 1967 to 1970
4 years toward BS Mechanical Engineering degree, Univ. of Michigan and BYU in Mechanical engineering, business management

Student At Full Time Student (Pre-Dental)

Roderick Davies Photo 3
Location:
Phoenix, Arizona Area
Industry:
Financial Services

Dental Student

Roderick Davies Photo 4
Location:
Oklahoma City, OK
Industry:
Higher Education
Work:
University of Oklahoma Health Sciences Center since May 2011
Dental Student The Vanguard Group Jan 2007 - Jan 2009
Investment Specialist Jatek International Dec 2005 - Mar 2007
Project Manager HealthEquity Apr 2004 - Dec 2005
Director of Corporate Development
Education:
Arizona State University
B.S., Economics
Skills:
Health Sciences

Dentist

Roderick Davies Photo 5
Work:
Burns Dentistry
Dentist

Phones & Addresses

Name
Addresses
Phones
Roderick D Davies
801-818-0876
Roderick D Davies
801-268-0955
Roderick D Davies
801-796-9799
Roderick H Davies
480-767-7657
Roderick W Davies
937-885-5193
Roderick C Davies
702-474-0623
Roderick Davies
801-226-4704
Roderick D Davies
801-796-9799

Business Records

Name / Title
Company / Classification
Phones & Addresses
Roderick D. Davies
President, Director
Architectural Specialty Products, Inc
327 SE Cardinal Way, Stuart, FL 34996
Roderick D Davies
President, Treasurer, Director
LORANDA, INC
327 Cardinal Way, Stuart, FL 34996
Roderick D Davies
Director
CLINICAL INNOVATIONS CORPORATION
409 SE Osceola Ave STE D, Stuart, FL 34995
409 SE Osceola St, Stuart, FL 34994
327 Cardinal Way, Stuart, FL 34996
Roderick D. Davies
Asian Sources, LLC
Business Services at Non-Commercial Site
9383 Avanyu Dr, Pleasant Grove, UT 84062
Roderick D. Davies
Vice President
Tri-Cor Products, Inc
3008 SE Waaler St, Stuart, FL 34997
Roderick D. Davies
Director
Marathon Technologies International, Inc
409 SE Osceola St, Stuart, FL 34994

Publications

Us Patents

Silicide Contacts For Cmos Devices

US Patent:
4476482, Oct 9, 1984
Filed:
May 13, 1982
Appl. No.:
6/377759
Inventors:
David B. Scott - Plano TX
Roderick D. Davies - Richardson TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 2348
H01L 2904
H01L 2946
H01L 2978
US Classification:
357 71
Abstract:
In the manufacture of a CMOS device, oxide is etched away from polysilicon gate-level interconnects, and from source or drain regions of either conductivity type to which the polysilicon gate-level interconnect is desired to be connected. A metal is then deposited, and silicide is formed to connect the gate-level interconnect to the respective source and drain regions. To ensure continuity of the silicide connection, the gate oxide beneath the gate level interconnect is slightly undercut by a wet etching process, additional polysilicon is deposited conformally overall, and the additional polysilicon is anisotropically etched so that it is removed from all areas except those within the undercut region beneath the gate-level interconnect thus a continuous surface of silicon, from which a continuous layer of silicide is then grown, exists between the polysilicon gate-level interconnect and the respective source and drain regions. Thus, self-aligned contacts are created, and no unwanted pn junctions are created.

Vertical-Etch Direct Moat Isolation Process

US Patent:
4418094, Nov 29, 1983
Filed:
Mar 2, 1982
Appl. No.:
6/353994
Inventors:
Roderick D. Davies - Richardson TX
Dennis C. Hartman - Plano TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 2700
US Classification:
427 38
Abstract:
Direct Moat Isolation for VLSI integrated circuit structures is formed by growing oxide over the entire substrate area, and then cutting windows in the oxide, using an anisotropic polymer-free oxide etch, where moat regions are to be formed. To prevent polysilicon filamentation, gate patterning is performed with an extremely selective polysilicon etch. The combination of these processing steps permits a direct moat isolation device fabrication process which is insensitive to the oxide sidewall angle, increasing yield and permitting extremely compact isolation structures to be formed.

Cmos Source/Drain Implant Process Without Compensation Of Polysilicon Doping

US Patent:
4420344, Dec 13, 1983
Filed:
Oct 15, 1981
Appl. No.:
6/311713
Inventors:
Roderick D. Davies - Richardson TX
David B. Scott - Plano TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 21263
H01L 2126
US Classification:
148 15
Abstract:
CMOS source/drain regions of both conductivity types are formed using only a single masking step. One dopant is applied to both types of source/drain regions, and a second dopant is applied at a much higher dose and energy to only one type of source/drain region. Preferably, boron and arsenic are used as the dopants in silicon, since the cooperative diffusion effect causes the boron in the counterdoped source/drain regions to be entirely contained within the arsenic diffusion. To avoid the erratic etching characteristics of heavily-doped polysilicon under chloro-etch, the patterned photoresist used to pattern the gates and gate-level interconnects is left in place during the P+ source/drain implant. Thus, moderately doped N-type polysilicon may be used, since it is not exposed to compensation by the P+ implant. Since no P+ source/drain mask is required, no double-level photoresist structure is created, and there is consequently no obstacle to reworks.

Mask-Saving Technique For Forming Cmos Source/Drain Regions

US Patent:
4406710, Sep 27, 1983
Filed:
Oct 15, 1981
Appl. No.:
6/311684
Inventors:
Roderick D. Davies - Richardson TX
David B. Scott - Plano TX
International Classification:
H01L 21265
B01J 1700
US Classification:
148 15
Abstract:
CMOS source/drain regions of both conductivity types are formed using only a single masking step. One dopant is applied to both types of source/drain regions, and a second dopant is applied at a much higher dose and energy to only one type of source/drain region. Preferably, boron and arsenic are used as the dopants in silicon, since the cooperative doping effect causes the boron in the counterdoped source/drain regions to be entirely contained within the arsenic diffusion.

Method Of Manufacturing Silicide Contacts For Cmos Devices

US Patent:
4374700, Feb 22, 1983
Filed:
May 29, 1981
Appl. No.:
6/268201
Inventors:
David B. Scott - Plano TX
Roderick D. Davies - Richardson TX
Assignee:
Texas Instruments Incorporated - Dallas TX
International Classification:
H01L 21308
H01L 2124
H01L 21283
US Classification:
156656
Abstract:
In the manufacture of a CMOS device, oxide is etched away from polysilicon gate-level interconnects, and from source or drain regions of either conductivity type to which the polysilicon gate-level interconnect is desired to be connected. A metal is then deposited, and silicide is formed to connect the gate-level interconnect to the respective source and drain regions. To ensure continuity of the silicide connection, the gate oxide beneath the gate level interconnect is slightly undercut by a wet etching process, additional polysilicon is deposited conformally overall, and the additional polysilicon is anistropically etched so that it is removed from all areas except those within the undercut region beneath the gate-level interconnect thus a continuous surface of silicon, from which a continuous layer of silicide is then grown, exists between the polysilicon gate-level interconnect and the respective source and drain regions. Thus, self-aligned contacts are created, and no unwanted pn junctions are created.

FAQ: Learn more about Roderick Davies

What are Roderick Davies's alternative names?

Known alternative names for Roderick Davies are: Robert Miller, Debbie Davis, Norma Davis, Frederick Davies, Kevin Davies, Tynisha Davies, Debra Darus. These can be aliases, maiden names, or nicknames.

What is Roderick Davies's current residential address?

Roderick Davies's current known residential address is: 6453 Big Pine Way, Las Vegas, NV 89108. Please note this is subject to privacy laws and may not be current.

What are the previous addresses of Roderick Davies?

Previous addresses associated with Roderick Davies include: 4031 Rousseau Ln, Pls Vrds Pnsl, CA 90274; 3011 F Dr, Amana, IA 52203; 9383 Avanyu Dr, Cedar Hills, UT 84062; 6453 Big Pine Way, Las Vegas, NV 89108; 1941 Desert Greens Ln, Fort Mohave, AZ 86426. Remember that this information might not be complete or up-to-date.

Where does Roderick Davies live?

Las Vegas, NV is the place where Roderick Davies currently lives.

How old is Roderick Davies?

Roderick Davies is 54 years old.

What is Roderick Davies date of birth?

Roderick Davies was born on 1969.

What is Roderick Davies's email?

Roderick Davies has such email addresses: lori***@earthlink.net, blkpan***@cox.net, roderickhbdav***@yahoo.com. Note that the accuracy of these emails may vary and they are subject to privacy laws and restrictions.

What is Roderick Davies's telephone number?

Roderick Davies's known telephone numbers are: 319-895-8973, 801-796-9799, 702-474-0623, 801-226-4704, 650-917-9306, 801-818-0876. However, these numbers are subject to change and privacy restrictions.

How is Roderick Davies also known?

Roderick Davies is also known as: Raymond Davies, Roderick Dazies, Roderick C Davis. These names can be aliases, nicknames, or other names they have used.

Who is Roderick Davies related to?

Known relatives of Roderick Davies are: Robert Miller, Debbie Davis, Norma Davis, Frederick Davies, Kevin Davies, Tynisha Davies, Debra Darus. This information is based on available public records.

People Directory:

A B C D E F G H I J K L M N O P Q R S T U V W X Y Z