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Ravi Mahajan

In the United States, there are 9 individuals named Ravi Mahajan spread across 19 states, with the largest populations residing in California, New Jersey, Pennsylvania. These Ravi Mahajan range in age from 46 to 71 years old. Some potential relatives include Subhash Mahajan, Sanjoy Mahajan, Ashish Mahajan. The associated phone number is 602-339-9432, along with 5 other potential numbers in the area codes corresponding to 267, 270, 610. For a comprehensive view, you can access contact details, phone numbers, addresses, emails, social media profiles, arrest records, photos, videos, public records, business records, resumes, CVs, work history, and related names to ensure you have all the information you need.

Public information about Ravi Mahajan

Resumes

Resumes

Ravi Mahajan

Ravi Mahajan Photo 1
Location:
Philadelphia, PA
Industry:
Financial Services

Ravi Mahajan

Ravi Mahajan Photo 2
Work:
United States
Education:
Department of Technology, Savitribai Phule Pune University

Account Director Business Development

Ravi Mahajan Photo 3
Location:
Houston, TX
Industry:
Telecommunications
Work:
Nokia
Account Director Business Development Airtel Nov 2001 - Dec 2005
General Manager Ericsson 1996 - 1999
Senior Engineer
Education:
Govt High School Gurdaspur
Skills:
Wireless, Telecommunications, Mobile Devices, Lte, Gsm, Service Delivery, 3G, Vendor Management, Management, Umts, Team Management, Managed Services, Business Support System, Bss, 2G, Wireless Technologies, Universal Mobile Telecommunications System

Trendsetters

Ravi Mahajan Photo 4
Location:
Houston, TX
Industry:
Cosmetics

Owner

Ravi Mahajan Photo 5
Location:
Philadelphia, PA
Work:

Owner

High Wizard - Consumer Operations

Ravi Mahajan Photo 6
Location:
550 east Weddell Dr, Sunnyvale, CA 94089
Industry:
Outsourcing/Offshoring
Work:
Google
High Wizard - Consumer Operations Amazon Jan 2016 - Dec 2016
Operations Program Manager, Virtual Programs Amazon Jan 2016 - Dec 2016
International Operations Manager, Reserves Audible, Inc. Jan 2015 - Jan 2016
Director of Customer Service and Outsourcing Amazon Apr 1, 2014 - Dec 1, 2014
Vcc Technology Manager and Senior Business Analyst Amazon Aug 2013 - Apr 2014
Kindle Customer Service Manager Amazon Jul 2012 - Aug 2013
Customer Service Manager Hitachi Automotive Systems Americas, Inc. Sep 1, 2011 - May 1, 2012
Intern University of Kentucky Aug 1, 2009 - May 1, 2012
Technical Crew Leader University of Kentucky 2010 - 2011
It Support Analyst The Ohio State University Wexner Medical Center 2008 - 2009
Access Control Analyst The Ohio State University 2007 - 2008
It Support Staples 2006 - 2007
Computers and Electronics Sales Target 2005 - 2006
Customer Service Associate
Skills:
Team Building, Information Technology, Lean Manufacturing, Cross Functional Team, Executive Education, Retail, Windows, Sales, Mac Os X, Event Planning, Program Manager, Clinical Research, Data Analysis, Customer Satisfaction, Market Research, Supply Chain Management, Interactive Intelligence, Team Management, Team Leadership, Process Improvement, Access Control, Healthcare Information, Quality Assurance, Operations, Lean Operations, Microsoft Office, Microsoft Excel, Healthcare Information Technology, Cross Functional Team Leadership, Training, Bmc Remedy, Time Management, Customer Service, Customer Support, Instructional Design, Microbiology, Business Process Improvement, Management, Product Development, Knowledge Management, Healthcare Management, Marketing Strategy, Adobe Creative Suite, Information Management, Mysql, Access
Languages:
English
Spanish
Hindi
Gujarati
Certifications:
Emt-Basic
Lean Six Sigma Greenbelt

Ravi Mahajan

Ravi Mahajan Photo 7
Location:
Olathe, KS
Industry:
Computer Software
Work:
Hexaware Technologies 2000 - 2003
Assistant General Manager and Project Manager Datamatics Global Services Limited 1999 - 2002
Project Manager Indian Air Force 1996 - 2000
Dy General Manager Indian Air Force 1970 - 1996
Inventory Manager and Logistics Analyser

Ravi Mahajan

Ravi Mahajan Photo 8
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Phones & Addresses

Name
Addresses
Phones
Ravi Mahajan
610-337-2141
Ravi Mahajan
215-269-2948
Ravi Mahajan
215-428-0988
Ravi Mahajan
270-244-0953

Publications

Us Patents

Micro-Channel Heat Exchangers And Spreaders

US Patent:
6934154, Aug 23, 2005
Filed:
Mar 31, 2003
Appl. No.:
10/404215
Inventors:
Ravi Prasher - Tempe AZ, US
Ravi Mahajan - Tempe AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K007/20
US Classification:
361699, 361689, 361698, 257714, 174 151, 165 804, 165185
Abstract:
Two-phase microchannel heat exchangers for cooling integrated circuit (IC) dies and cooling systems employing the same are disclosed. The heat exchangers include thermal masses having a plurality of microchannels formed therein. In one set of configurations, the IC die is coupled to a thermal mass having a plurality of open microchannels such that a hermetic seal is formed between the die and the bases of the microchannel walls, thus forming a plurality of closed microchannels. In another set of configurations, a separate microchannel heat exchanger is thermally coupled to an IC die and operatively coupled to the IC die via coupling to a substrate on which the IC die is mounted. The microchannel heat exchangers may be employed in a closed loop cooling system includes a pump and a heat rejecter. The microchannels are configured to support two-phase heat transfer using a working fluid such as water.

Using External Radiators With Electroosmotic Pumps For Cooling Integrated Circuits

US Patent:
6992381, Jan 31, 2006
Filed:
Oct 31, 2003
Appl. No.:
10/698749
Inventors:
Sarah E. Kim - Portland OR, US
R. Scott List - Beaverton OR, US
James G. Maveety - San Jose CA, US
Alan M. Myers - Portland OR, US
Quat T. Vu - Santa Clara CA, US
Ravi Prasher - Phoenix AZ, US
Ravi Mahajan - Tempe AZ, US
Gilroy Vandentop - Tempe AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 23/34
US Classification:
257713, 361699, 16510411, 417313
Abstract:
An integrated circuit to be cooled may be abutted in face-to-face abutment with a cooling integrated circuit. The cooling integrated circuit may include electroosmotic pumps to pump cooling fluid through the cooling integrated circuits via microchannels to thereby cool the heat generating integrated circuit. The electroosmotic pumps may be fluidically coupled to external radiators which extend upwardly away from a package including the integrated circuits. In particular, the external radiators may be mounted on tubes which extend the radiators away from the package.

Partial Underfill For Flip-Chip Electronic Packages

US Patent:
6365441, Apr 2, 2002
Filed:
Oct 23, 2000
Appl. No.:
09/694802
Inventors:
George F. Raiser - Chandler AZ
Bob Sundahl - Chandler AZ
Ravi Mahajan - Tempe AZ
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 2144
US Classification:
438127, 438108, 438118, 438126
Abstract:
An integrated circuit package that contains an underfill material between an integrated circuit and a substrate. The integrated circuit may be mounted to the substrate with solder bumps in a C4 process. The underfill material may extend from an edge of the integrated circuit a length that is no less than approximately 25% of the length between the integrated circuit edge and the integrated circuit center. It has been discovered that a length greater than approximately 25% does not provide a significant reduction in the strain of the solder bumps.

Electronic Packages, Assemblies, And Systems With Fluid Cooling

US Patent:
7126822, Oct 24, 2006
Filed:
Mar 31, 2003
Appl. No.:
10/404310
Inventors:
Chuan Hu - Chandler AZ, US
Ravi V. Mahajan - Tempe AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 7/20
US Classification:
361699, 361689, 361698, 361700, 257714, 257715, 165 804, 174 151
Abstract:
To accommodate high power densities associated with high-performance integrated circuits, an integrated circuit (IC) package includes a heat-dissipating structure in which heat is dissipated from a surface of one or more dice to a heat spreader. The heat spreader has a fluid-conducting channel formed therein, and a fluid coolant may be circulated through the channel via a micropump. In an embodiment, the channel is located at or near a surface of the heat spreader, and a heat-generating IC is in thermal contact with the heat spreader. In an embodiment, the IC is a thinned die that is coupled to the heat spreader via a thinned thermal interface material. Methods of fabrication, as well as application of the package to an electronic assembly and to an electronic system, are also described.

Microelectronic Die Having A Thermoelectric Module

US Patent:
7279796, Oct 9, 2007
Filed:
Aug 8, 2003
Appl. No.:
10/638038
Inventors:
Chuan Hu - Chandler AZ, US
Gregory M. Chrysler - Chandler AZ, US
Ravi V. Mahajan - Tempe AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 23/48
H01L 23/52
H01L 29/40
US Classification:
257778, 257712, 257720
Abstract:
A microelectronic die is provided having an integrated thermoelectric module. The microelectronic die has a die substrate, a microelectronic circuit formed on a front side of the die substrate, and the thermoelectric module on a backside of the die substrate. Vias in the substrate interconnect the thermoelectric module with power and ground planes on the front side of the die substrate.

Partial Underfill For Flip-Chip Electronic Packages

US Patent:
6700209, Mar 2, 2004
Filed:
Dec 29, 1999
Appl. No.:
09/474746
Inventors:
George F. Raiser - Chandler AZ
Bob Sundahl - Chandler AZ
Ravi Mahajan - Tempe AZ
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H01L 2329
US Classification:
257790, 257787, 257782, 257778, 257737, 257738, 257780
Abstract:
An integrated circuit package that contains an underfill material between an integrated circuit and a substrate. The integrated circuit may be mounted to the substrate with solder bumps in a C4 process. The underfill material may extend from an edge of the integrated circuit a length that is no less than approximately 25% of the length between the integrated circuit edge and the integrated circuit center. It has been discovered that a length greater than approximately 25% does not provide a significant reduction in the strain of the solder bumps.

Computer System Having Controlled Cooling

US Patent:
7508671, Mar 24, 2009
Filed:
Oct 10, 2003
Appl. No.:
10/683924
Inventors:
Ioan Sauciuc - Phoenix AZ, US
Gregory M. Chrysler - Chandler AZ, US
Ravi V. Mahajan - Tempe AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 7/20
G05B 9/02
US Classification:
361700, 361695, 361697, 361687, 165 803, 165 804, 16510433, 165185, 257712, 62 32, 62 36, 62 37, 700 79, 700299, 700300, 219499, 219497, 219505
Abstract:
A computer system and its method of cooling are provided. A vapor chamber serves as a heat spreader for heat from the microelectronic die. A thermoelectric module serves to cool the vapor chamber and maintain proper functioning of the vapor chamber, thus keeping the microelectronic die cooled. A controller receives input from five temperature sensors, and utilizes the input to control current to the thermoelectric module and voltage/current to a motor that drives a fan and provides additional cooling. A current sensor allows the controller to monitor and limit power provided to the thermoelectric module.

Electromagnetically-Actuated Micropump For Liquid Metal Alloy Enclosed In Cavity With Flexible Sidewalls

US Patent:
7539016, May 26, 2009
Filed:
Dec 30, 2005
Appl. No.:
11/322495
Inventors:
Ioan Sauciuc - Phoenix AZ, US
Ravi Mahajan - Phoenix AZ, US
Assignee:
Intel Corporation - Santa Clara CA
International Classification:
H05K 7/20
F04B 43/14
US Classification:
361699, 361688, 361689, 257714, 417322, 417412, 4174131, 417474
Abstract:
The present invention discloses a method of confining a liquid metal alloy within a closed-loop system; distributing a first portion of the liquid metal alloy in a cavity within the closed-loop system; turning on an electromagnet to generate a magnetic field to permeate flexible sidewalls of the cavity; attracting the liquid metal alloy in the cavity towards the electromagnet to expand the flexible sidewalls; inducing a second portion of the liquid metal alloy to enter the cavity from an inlet end of a pipe within the closed-loop system; turning off the electromagnet; repelling the liquid metal alloy in the cavity away from the electromagnet to contract the flexible sidewalls; and inducing a third portion of the liquid metal alloy to exit the cavity to an outlet end of the pipe.

FAQ: Learn more about Ravindranath Mahajan

How old is Ravindranath Mahajan?

Ravindranath Mahajan is 60 years old.

What is Ravindranath Mahajan date of birth?

Ravindranath Mahajan was born on 1964.

What is Ravindranath Mahajan's telephone number?

Ravindranath Mahajan's known telephone numbers are: 602-339-9432, 267-306-0843, 270-244-0953, 610-337-2141, 215-269-2948, 215-428-0988. However, these numbers are subject to change and privacy restrictions.

How is Ravindranath Mahajan also known?

Ravindranath Mahajan is also known as: Ravindranat Mahajan, Ravi V Mahajan, Ravi D Mahajan, Ravl J Mahajan, Ravi N, Ravindranadh Mahjan, H Mahajah. These names can be aliases, nicknames, or other names they have used.

Who is Ravindranath Mahajan related to?

Known relatives of Ravindranath Mahajan are: Sanjoy Mahajan, Subhash Mahajan, Sunit Mahajan, Ashish Mahajan. This information is based on available public records.

What are Ravindranath Mahajan's alternative names?

Known alternative names for Ravindranath Mahajan are: Sanjoy Mahajan, Subhash Mahajan, Sunit Mahajan, Ashish Mahajan. These can be aliases, maiden names, or nicknames.

What is Ravindranath Mahajan's current residential address?

Ravindranath Mahajan's current known residential address is: 333 W Malibu Dr, Chandler, AZ 85248. Please note this is subject to privacy laws and may not be current.

What are the previous addresses of Ravindranath Mahajan?

Previous addresses associated with Ravindranath Mahajan include: 11 Mt Airy Dr, Morrisville, PA 19067; 946 E Duane Ave, Sunnyvale, CA 94085; 6635 Waterford Pl, Owensboro, KY 42303; 550 E Weddell Dr, Sunnyvale, CA 94089; 1957 Divot Dr, Tempe, AZ 85283. Remember that this information might not be complete or up-to-date.

Where does Ravindranath Mahajan live?

Chandler, AZ is the place where Ravindranath Mahajan currently lives.

How old is Ravindranath Mahajan?

Ravindranath Mahajan is 60 years old.

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