Philip Saunders

In the United States, there are 263 individuals named Philip Saunders spread across 42 states, with the largest populations residing in Florida, Ohio, Maryland.

Public information about Philip Saunders

Resumes

Test And Evaluation Engineer

Location:

Rochester, MI

Industry:

Defense & Space

Work:

TACOM - Warren, Mi since Jan 2012
Test and Evaluation Engineer US Army Sep 2009 - Feb 2013
Reliability Engineer General Motors 2008 - 2009
Design Release Engineer General Motors Mar 1997 - Nov 2008
Safety Integraton Engineer General Motors Jun 1995 - Mar 1997
Measurement Test Engineer General Motors Nov 1993 - Jun 1995
Durability Test Analyst Allen-Bradley Jan 1989 - Nov 1993
Senior Project Engineer

Education:

Purdue University 1995 - 2000
Masters, Multidisciplinary Engineering University of Wisconsin-Madison 1984 - 1989
Bachelors, Mechanical Engineering

Skills:

Six Sigma, Assembly Language, Testing, Injection Molding

Interests:

League Manager For Gm Linksters
Golf
Hunting
Marine Fishkeeping

General Manager

Location:

San Francisco, CA

Industry:

Construction

Work:

Acme Roofing Jan 2002 - Aug 2011
Estimator Anderson Roofing & Sheet Metal Jan 2002 - Aug 2011
General Manager Pacific Coast Roofing Jan 1988 - Aug 2002
Owner

Education:

College of San Mateo 2006 - 2008

Skills:

Green Building, Construction Management

Certifications:

License 522328
License 5321751 B1&B2
Cslb, License 522328
International Code Council, License 5321751 B1&Amp;B2

Corporate & Investment Bank Audit, Jpmorgan

Position:

Corporate Investment Bank Audit at JPMorgan Chase

Location:

New York, New York

Industry:

Investment Banking

Work:

JPMorgan Chase - New York City since Jul 2009
Corporate Investment Bank Audit J.P. Morgan - UK Jan 2005 - Jul 2009
Business Analyst/ Developer Royal Dutch Shell Jul 2002 - Aug 2003
Graduate Technology Intern

Education:

Bournemouth University
BSc Hons 2.1, Business IT Portsmouth Grammar School

Skills:

CISA, Investment Banking, Business Analysis, Project Management, ISEB Diploma in Business Analysis, Applications Software Development, Risk Management, Auditing, Private Equity, Hedge Funds, Treasury Services, Derivatives

Building Supervisor V

Location:

Washington, DC

Industry:

Education Management

Work:

Pgcps
Building Supervisor V

Skills:

Leadership, Teaching, Staff Development, Public Speaking, Customer Service, Curriculum Development

Vice President Engineering

Location:

Charleston, WV

Work:

Warrior Met Coal
Vice President Engineering

Education:

University of Virginia Darden School of Business 2008 - 2011

Senior Account Manager

Location:

10107 Longdale Ave, Glen Allen, VA 23060

Industry:

Consumer Services

Work:

Abbott Jul 2011 - Jul 2013
Account Manager Abbott Jul 2011 - Jul 2013
Senior Account Manager

Education:

Hampden - Sydney College 2006 - 2010
Bachelors, Bachelor of Science, Economics, Commerce Hermitage High School 2002 - 2006

Skills:

Marketing, Customer Service, Account Management, Management, Public Speaking, Microsoft Excel, Event Planning, Sales, Powerpoint, Microsoft Office, Leadership, Team Building, Strategic Planning, Social Media

Maitre D'

Location:

New York, NY

Industry:

Food Production

Work:

Raoul's Restaurant
Maitre D'

Retired

Location:

Dunn Loring, VA

Industry:

Legal Services

Work:

Retired

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Data provided by Veripages

Phones & Addresses

Name

Addresses

Phones

Philip A Saunders

35-1007 Hudson St, Jersey City, NJ 07302

Philip A Saunders

5 Pinecone Dr, Echelon, NJ 08043

856-751-1355

Philip A. Saunders

Crotonville, NY

914-762-5908

Philip A Saunders

105 Millwood Rd, Millwood, NY 10546

914-762-5908

Philip A Saunders

2474 County Road 1, Southpoint, OH 45680

740-377-9293

Philip C. Saunders

Scottsville, NY

585-889-2027

Philip A Saunders

1187 Maple Ave, Lancaster, PA 17603

717-397-9294

Philip A Saunders

2777 Charlestown Rd, Lancaster, PA 17603

717-397-9294

Philip Saunders

19086 Schuster Ave, Hayward, CA 94546

Philip Saunders

1 Upland Dr, Salem, VA 24153

Philip Saunders

10070 Bandy Rd, North Benton, OH 44449

Philip Saunders

20 Oxford Rd, Billerica, MA 01862

978-828-8093

Philip Saunders

2108 Crocker St, Houston, TX 77006

713-492-2586

Philip Saunders

102 Candy Cir, Carrollton, GA 30117

706-599-2147

Philip Saunders

2134 Saranac Ct, Charlottesville, VA 22911

540-885-5774

Philip Saunders

239 Park St, South Attleboro, MA 02703

508-226-5863

Business Records

Name / Title

Company / Classification

Phones & Addresses

Philip Saunders
President

Kingston Resources Inc
Lumber and Other Building Materials Dealers

Rr 1 Box 76C, Scarbro, WV 25917
Website: foundationcoal.com

Philip Saunders
Owner

Philip Saunders Associates
Renewables & Environment · Ecnomic Consulting

445 Gln Rd, Weston, MA 02493
781-239-0855

Philip W Saunders

Century 2000 Realty
Real Estate Agents and Managers

6709 La Tijera Blvd Ste 127, Los Angeles, CA 90045

Philip Saunders
President

Kingston Resources Inc
Other Building Material Dealers

Rr 1 BOX 76C, Scarbro, WV 25917
304-469-4974, 304-469-4871

Philip W. Saunders
President

WSC Synergy Investments
Investment Management

6709 Ln Tijera Blvd #127, Los Angeles, CA 90045

Philip Saunders
President

Abi
Pumps and Pumping Equipment

Po Box 909, Villa Rica, GA 30180
Website: abi-irrigation.com

Philip Saunders
Director

Torvec, Inc.
Automotive · A Development Stage Company Engaged In Development of Automotive Technology · A Development Stage Company Engaged In The Development of Automotive Technology · Automotive Technology · Mfg Motor Vehicle Parts & Accessories · Transmission Repair

1999 Mt Read Blvd BUILDING 3, Rochester, NY 14615
585-254-1100, 585-254-1105

Philip Saunders
CO P

NATIONAL DISTRIBUTION CONSULTANTS, LLC

500 W Madison St STE 2400, Chicago, IL 60661
2 Gtwy Ctr SUITE 300, Pittsburgh, PA 15222

Publications

Us Patents

Mounting Means For A Printing Plate

US Patent:

3934509, Jan 27, 1976

Filed:

Apr 8, 1974

Appl. No.:

5/458910

Inventors:

Philip G. Saunders - Toledo OH
Jack R. Simpson - Toledo OH

Assignee:

Container Graphics Corporation - Toledo OH

International Classification:

B41F 2706
B65D 6702

US Classification:

1014151

Abstract:

Mounting means for mounting a printing plate on a printing plate cylinder are provided. The mounting means include a mounting member or sheet made of a plastic sheet material which is solvent resistant, strong, dimensionally stable, conforms truly to the printing plate cylinder, and is of uniform thickness. The leading edge of the mounting member is turned back to form a structurally-integral lip thereon which is readily connected to a mounting flange on the printing plate cylinder. The mounting means further include a mounting strap which affixes the mounting member on the cylinder with the lip engaged with the flange of the cylinder. The mounting strap has a first portion received in an opening of the mounting member and a second portion having an integral lip which engages another mounting flange of the printing cylinder. A resilient band connects the first and second portions and is in tension when the first portion is connected to the mounting member and the second portion is connected to the cylinder flange. Preferably two resilient bands are used so that one will still hold the mounting member if the other breaks.

Hole Punch For A Cutting Die

US Patent:

4522095, Jun 11, 1985

Filed:

Sep 21, 1982

Appl. No.:

6/420729

Inventors:

Philip G. Saunders - Toledo OH
Jack R. Simpson - Toledo OH

Assignee:

Container Graphics Corporation - Toledo OH

International Classification:

B26D 706

US Classification:

83116

Abstract:

A punch for a cutting die is provided for forming holes in corrugated board or the like. The hole punch includes a tubular metal member of circular transverse cross section having one end substantially flush with the back surface of a die plate in which it is mounted and the other end extending beyond the front surface of the die plate and terminating in a circular cutting edge. A body of resilient material, preferably molded rubber, is located within the cylindrical member and has one end terminating near the back end of the tubular member and another end terminating near the cutting edge of the tubular member. The purpose of the body is to eject and strip the scrap of corrugated board from the punch and from the rest of the blank being formed by the cutting die. The resilient body has a central, cylindrical recess at one end which enables the resilient material to be deformed inwardly when engaging a corrugated board being cut by the circular cutting edge. The other end of the resilient body is closed off which enables the body to be more easily inserted in the tubular metal member.

Method Of Creating Defect Free High Ge Content (>25%) Sige-On-Insulator (Sgoi) Substrates Using Wafer Bonding Techniques

US Patent:

7235812, Jun 26, 2007

Filed:

Sep 13, 2004

Appl. No.:

10/939736

Inventors:

Jack O. Chu - Manhasset Hills NY, US
Michael A. Cobb - Croton on Hudson NY, US
Philip A. Saunders - Millwood NY, US
Leathen Shi - Yorktown Heights NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 29/00

US Classification:

257 65, 257347, 257616, 438311, 438479

Abstract:

A method for achieving a substantially defect free SGOI substrate which includes a SiGe layer that has a high Ge content of greater than about 25 atomic % using a low temperature wafer bonding technique is described. The wafer bonding process described in the present application includes an initial prebonding annealing step that is capable of forming a bonding interface comprising elements of Si, Ge and O, i. e. , interfacial SiGeO layer, between a SiGe layer and a low temperature oxide layer. The present invention also provides the SGOI substrate and structure that contains the same.

Hole Punch For A Cutting Die

US Patent:

4306476, Dec 22, 1981

Filed:

Jan 9, 1980

Appl. No.:

6/110781

Inventors:

Philip G. Saunders - Toledo OH
Jack R. Simpson - Toledo OH

Assignee:

Container Graphics Corporation - Toledo OH

International Classification:

B21D 4504

US Classification:

83117

Abstract:

A punch for a cutting die is provided for forming holes in corrugated board or the like. The hole punch includes a tubular metal member of circular transverse cross section having one end substantially flush with the back surface of a die plate in which it is mounted and the other end extending beyond the front surface of the die plate and terminating in a circular cutting edge. A body of resilient material, such as natural gum rubber or latex, is located within the cylindrical member and has one end terminating near the back end of the tubular member and another end terminating near the cutting edge of the tubular member. The purpose of the body is to eject and strip the scrap of corrugated board from the punch and from the rest of the blank being formed by the cutting die. The resilient body has a central, cylindrical passage extending completely therethrough, in a preferred form. This central passage enables the resilient material to be deformed inwardly when engaging a corrugated board being cut by the circular cutting edge, which provides a much longer life for the body of resilient material.

Apparatus For Printing Indicia On Corrugated Board And The Like

US Patent:

4047481, Sep 13, 1977

Filed:

Mar 1, 1976

Appl. No.:

5/662561

Inventors:

Philip G. Saunders - Toledo OH

Assignee:

Container Graphics Corporation - Toledo OH

International Classification:

B41F 2712

US Classification:

101376

Abstract:

Apparatus for printing indicia on corrugated board in particular is provided. The apparatus includes a printing plate made of a polymer material which has a number of advantages over conventional printing plate materials. However, because the polymer material is somewhat resilient and exhibits a degree of yieldability, and dimensionally-stable sheet is provided, which is either on the back of the material or molded into the material near the back. The printing plate is adhered to a mounting sheet which is also dimensionally stable and is mounted on a printing plate cylinder. A resilient or compressible layer or pad is affixed to the back of the mounting sheet, between the mounting sheet and the printing cylinder, and is of a size at least equal to that of the printing plate. The pad provides additional compressibility and resiliency to enable the printing plate to effectively print indicia on corrugated board and also raises the printing surfaces of the printing plate farther from the surface of the printing plate cylinder.

Method Of Creating Defect Free High Ge Content (> 25%) Sige-On-Insulator (Sgoi) Substrates Using Wafer Bonding Techniques

US Patent:

7445977, Nov 4, 2008

Filed:

May 4, 2007

Appl. No.:

11/744600

Inventors:

Jack O. Chu - Manhasset Hills NY, US
Michael A. Cobb - Croton on Hudson NY, US
Philip A. Saunders - Millwood NY, US
Leathen Shi - Yorktown Heights NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 21/336

US Classification:

438197, 257E27099

Abstract:

Sports Statistical Analytic Device

US Patent:

2012006, Mar 15, 2012

Filed:

Sep 7, 2011

Appl. No.:

13/226957

Inventors:

Swaptak Das - Alexandria VA, US
Panutat Khunachak - Alexandria VA, US
Philip Saunders - Medina MN, US
Ryan Saunders - Medina MN, US
Stephen Acott - Alexandria VA, US

Assignee:

GAMETIME CONCEPTS LLC - Alexandria VA

International Classification:

A63F 9/24

US Classification:

463 7, 463 42

Abstract:

A system and method of web-based computer software and hardware is disclosed for recording and analyzing sports statistics to allow a sports team to evaluate the efficiency of its team, players, lineups, games, plays, playbooks, and other related attributes. Computerized algorithms analyze thousands of complex event outcomes based on various user specifications to produce innumerable statistical results. The system is optimized for use on a touch-screen tablet computer but can also be accessed via any computing device with a web browser and an Internet connection. The invention is designed to be used in real-time, but can also be used after the game to record event information or analyze previously recorded data.

Method Of Creating Defect Free High Ge Content (>25%) Sige-On-Insulator (Sgoi) Substrates Using Wafer Bonding Techniques

US Patent:

7704815, Apr 27, 2010

Filed:

Jun 17, 2008

Appl. No.:

12/140600

Inventors:

Jack O. Chu - Manhasset Hills NY, US
Michael A. Cobb - Croton on Hudson NY, US
Philip A. Saunders - Millwood NY, US
Leathen Shi - Yorktown Heights NY, US

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

H01L 21/336

US Classification:

438197, 257E21129

Abstract:

Videos & Images

Youtube

Robert Manning Cbs Interview

Duration:

2m 50s

Category:

Education

Description:

Robert Manning, professor of finance in RIT's E. Philip Saunders College of Business, discusses consumer debt relief program. Story does not reference RIT affiliation. These days more people are using credit cards to pay day to day expenses hoping to stay afloat. Others are already drowning in debt....

Saunders College Of Business, Rit, Experiential Learning

Duration:

10m 21s

Category:

Education

Description:

A video exploring the experiential approaches to learning in the E. Philip Saunders College of Business at Rochester Institute of Technology.

Caribbean Airlines Ceo Philip Saunders

Duration:

3m 10s

Category:

Entertainment

Description:

Caribbean Airlines Chief Executive Officer Philip Saunders gives a verbel report on Caribbean Airlines during the collapse of the global airline industry of 2008. This interview was during the IATA Annual Conference in 2008 in Istanbul, Turkey. Mr Saunders was interviewed by his predecessor at Carib...

Meet E. Philip Saunders, Eagle Scout And Entrepreneur

Duration:

4m 50s

Channel:

Scouting Magazine

Description:

Scouting instilled the principles Eagle Scout E. Philip Saunders relied on as he built one of the first truck stop chains in the country...

Artist Spotlight Interview - Phil Saunders

Duration:

2h 30m 59s

Channel:

M.A.N Studios

Description:

Had an amazing interview with the legend Phil Saunders, really had a great time chatting together. Some audio issues, not sure...

Rit On Tv News: Shukria Amani

Duration:

3m 15s

Category:

Education

Description:

R News profiles Shukria Amani, an MBA student at Rochester Institute of Technology's E. Philip Saunders College of Business, who discusses her exodus from Afghanistan and the ongoing plight of that country and its people. Shukria Amani is pursuing her MBA degree from the E. Philip Saunders College o...

Philip Saunders Regular Season Mix!!!

Duration:

3m 37s

Channel:

RisingHoops

Phil Saunders The Worlds Best Auctioneer #Welcome2Cardiff

Duration:

4m 2s

Channel:

#Welcome2Cardiff OFFICIAL PAGE

Description:

Phil Saunders is The worlds best auctioneer... the best prices and the best camaraderie .. Get to Splott market to find out.

FAQ: Learn more about Philip Saunders

What is Philip Saunders date of birth?

Philip Saunders was born on 1966.

What is Philip Saunders's email?

Philip Saunders has such email addresses: philip.saund***@gmail.com, diand***@aol.com, philip.saund***@cfl.rr.com, dahmo***@hotmail.com, philip.mike.saund***@gmail.com, philip.saund***@att.net. Note that the accuracy of these emails may vary and they are subject to privacy laws and restrictions.

What is Philip Saunders's telephone number?

Philip Saunders's known telephone numbers are: 914-762-5908, 585-889-2027, 440-439-6185, 978-667-8818, 978-663-6848, 510-267-0503. However, these numbers are subject to change and privacy restrictions.

How is Philip Saunders also known?

Philip Saunders is also known as: Philip T Saunders, Phillip C Saunders, Phillip T Saunders, Phil C Saunders. These names can be aliases, nicknames, or other names they have used.

Who is Philip Saunders related to?

Known relatives of Philip Saunders are: Leonard Miller, Drake Saunders, Melaina Saunders, Cherry Saunders, Judith Vanstee, Kimberly Lammlin. This information is based on available public records.

What are Philip Saunders's alternative names?

Known alternative names for Philip Saunders are: Leonard Miller, Drake Saunders, Melaina Saunders, Cherry Saunders, Judith Vanstee, Kimberly Lammlin. These can be aliases, maiden names, or nicknames.

What is Philip Saunders's current residential address?

Philip Saunders's current known residential address is: 1690 Hillcrest Dr, Rochester Hls, MI 48306. Please note this is subject to privacy laws and may not be current.

What are the previous addresses of Philip Saunders?

Previous addresses associated with Philip Saunders include: 1669 Park, Washington, DC 20010; 6467 Long Breeze, Orlando, FL 32810; 102 Candy Cir, Carrollton, GA 30117; 1122 Clark St, Chicago, IL 60610; 109 White Oak, King, NC 27021. Remember that this information might not be complete or up-to-date.

Where does Philip Saunders live?

Rochester Hills, MI is the place where Philip Saunders currently lives.

How old is Philip Saunders?

Philip Saunders is 58 years old.

Name Variants	Phillip Saunders	Phil Saunders	Pip Saunders
Ages	39 to 97
Phones	914-762-5908	585-889-2027	440-439-6185
Addresses	12530 Braddock Dr Apt 113, Los Angeles, CA 90066	1669 Park, Washington, DC 20010	6467 Long Breeze, Orlando, FL 32810
Business records	Corporate Investment Bank Audit / JPMorgan Chase	Director / Plaintiff Advisory Group, LLC	Information Services Technician Iii / Counsyl

Philip Saunders

What do we know about Philip Saunders

Public information about Philip Saunders

Resumes

Resumes

Test And Evaluation Engineer

General Manager

Corporate & Investment Bank Audit, Jpmorgan

Building Supervisor V

Vice President Engineering

Senior Account Manager

Maitre D'

Retired

Phones & Addresses

Business Records

Publications

Us Patents

Mounting Means For A Printing Plate

Hole Punch For A Cutting Die

Method Of Creating Defect Free High Ge Content (>25%) Sige-On-Insulator (Sgoi) Substrates Using Wafer Bonding Techniques

Hole Punch For A Cutting Die

Apparatus For Printing Indicia On Corrugated Board And The Like

Method Of Creating Defect Free High Ge Content (> 25%) Sige-On-Insulator (Sgoi) Substrates Using Wafer Bonding Techniques

Sports Statistical Analytic Device

Method Of Creating Defect Free High Ge Content (>25%) Sige-On-Insulator (Sgoi) Substrates Using Wafer Bonding Techniques

FAQ: Learn more about Philip Saunders

Possible Relatives