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Jeremy Mccutcheon

In the United States, there are 33 individuals named Jeremy Mccutcheon spread across 28 states, with the largest populations residing in California, Texas, Florida. These Jeremy Mccutcheon range in age from 38 to 51 years old. Some potential relatives include Elizabeth Mcnamara, Patsy Mccoy, Carrie Cutcheon. You can reach Jeremy Mccutcheon through various email addresses, including brent.mccutch***@yahoo.com, skaterguy***@aol.com. The associated phone number is 603-903-0996, along with 6 other potential numbers in the area codes corresponding to 405, 520, 904. For a comprehensive view, you can access contact details, phone numbers, addresses, emails, social media profiles, arrest records, photos, videos, public records, business records, resumes, CVs, work history, and related names to ensure you have all the information you need.
Last updated 2024-03-02
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Jeremy D Mccutcheon , 49
Bullard, TX
Also known as:
Jeremy D Mccutchoun
Jeremy D Mccutcheson
Jeremy D Mc
Jeremy M Cutcheon
Has lived in:
Bullard, TX
Whitehouse, TX
Tyler, TX
Willingboro, NJ
Related to:
Lawrence Robinson, 76
Wes Robinson, 42
Carolyn Wines
Jeromy Jenkins, 48
PhoneAddress
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Jeremy T Mccutcheon , 38
Oceanside, CA
Also known as:
Jeremy Mccutheon
Jeremy Mckitchen
Jeremy M Cutcheon
Has lived in:
Oceanside, CA
Mission Viejo, CA
West Covina, CA
Rancho Santa Margarita, CA
Related to:
Jeremy Mccutcheon, 38
Kathleen Mccutcheon, 71
Marylou Mccutcheon
Shannon Mccutcheon, 42
PhoneAddress
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Jeremy P Mccutcheon , 43
Troutman, NC
Also known as:
Jeremy Mccutcheon
Jeremy M Mccutcheon
Jeremy Nccutcheon
Jeremy Mc
Has lived in:
Troutman, NC
Saint Albans, WV
Elkview, WV
South Charleston, WV
Related to:
Anthony Thornton, 64
Sherrie Bias, 74
Jeremy Mccutcheon, 43
Bethanie Mccutcheon, 38
PhoneAddress
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Jeremy R Mccutcheon , 41
Lakeland, FL
Also known as:
Jeremy K Mccutcheon
John Mccutcheon
Judy Mccutcheon
Jeremy Mc
Has lived in:
Lakeland, FL
Gainesville, FL
Warren, MI
Dayton, NV
Related to:
Nicole Mccullough, 49
Leslie Downard, 63
Destiny Boldizar
Lisa Boldizar
PhoneAddress
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Jeremy S Mccutcheon , 51
Peterborough, NH
Also known as:
Jeremy M Mccutcheon
Melissa Mccutcheon
Jeremy Mccuttheon
Jeremy M Cutcheon
Has lived in:
Peterborough, NH
Sharon, NH
Dayville, CT
Keene, NH
Related to:
Dylan Jordan, 30
Kayla Joyce, 31
Jordan Mccutcheon, 30
Antoinette Mccutcheon
PhoneAddress
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Jeremy S Mccutcheon , 48
Harrison, AR
Also known as:
Jennifer Mccutcheon
Jeremy Mccutheon
Jeremy M Cutcheon
Jermy S Mcmutcheon
Has lived in:
Harrison, AR
Cedar Hill, TX
Montgomery Creek, CA
Sanford, NC
Related to:
Isabella Mccutcheon, 21
Kenneth Mccutcheon
Rodney Mccutcheon, 57
Tobey Mccutcheon, 55
PhoneAddress
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Jeremy L Mccutcheon , 47
Mobile, AL
Also known as:
Jeremy Mccutchen
Jeremy Mc
Jeremy L Mccutcheson
Jeremy M Cutcheon
Has lived in:
Mobile, AL
Hytop, AL
Huntsville, AL
Scottsboro, AL
Related to:
Melissa Mccall, 53
Patsy Mccoy, 68
Terrie Roush, 57
Brittney Cutcheon
PhoneAddress
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Jeremy A Mccutcheon , 48
Floyds Knobs, IN
Also known as:
Jeremy Mc
Jeremy A Muccutcheon
Jeremy M Cutcheon
Has lived in:
Floyds Knobs, IN
Sellersburg, IN
New Albany, IN
Charlestown, IN
Related to:
Tina Moody, 63
Rebecca Moreland, 51
Valarie Trafford, 55
Donna Mccutcheon, 30
PhoneAddress
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Jeremy H Mccutcheon , 41
Pekin, IN
Has lived in:
Pekin, IN
Borden, IN
Salem, IN
Related to:
Bradley Smith, 34
Cindy Smith, 63
Kendra Davidson, 56
Jessica Mccutcheon, 45
PhoneAddress
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Jeremy Mccutcheon  Deceased
Larimer, PA
Has lived in:
Larimer, PA
Related to:
Debra Harrison, 65
David Mccutcheon, 52
Danne Mccutcheon, 56
Charles Mccutcheon, 100
PhoneAddress
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Public information about Jeremy Mccutcheon

Resumes

Resumes

Jeremy Mccutcheon

Jeremy Mccutcheon Photo 1
Location:
Kennesaw, GA

Factory Worker

Jeremy Mccutcheon Photo 2
Location:
Louisville, KY
Work:
Apollo
Factory Worker

Senior Account Executive

Jeremy Mccutcheon Photo 3
Location:
Saint Albans, WV
Industry:
Business Supplies And Equipment
Work:
Seedcomm Sep 2016 - Jan 2018
Senior Account Manager Pomeroy Sep 1, 2011 - Sep 2016
Tse American Signature Inc. Jul 2004 - Aug 2011
Sales Presentation Systems South, Inc. Jul 2004 - Aug 2011
Senior Account Executive
Education:
Marshall University
Skills:
Networking, Account Management, Management, Solution Selling, Salesforce.com, Customer Service, Managed Services

Jeremy Mccutcheon

Jeremy Mccutcheon Photo 4

Mechanic

Jeremy Mccutcheon Photo 5
Location:
Dallas, TX
Work:

Mechanic

R And D Manager

Jeremy Mccutcheon Photo 6
Location:
2401 Brewer Dr, Rolla, MO 65401
Industry:
Semiconductors
Work:
Brewer Science
R&D Manager
Education:
Missouri University of Science and Technology 1995 - 1998
Bachelors, Mechanical Engineering Missouri Southern State University 1991 - 1995
Bachelors, Biology, Chemistry
Skills:
R&D, Design of Experiments, Semiconductors, Electronics, Semiconductor Industry, Thin Films, Product Development, Materials Science, Metrology, Characterization, Ic, Photolithography, Failure Analysis, Spc, Nanotechnology

Mechanic

Jeremy Mccutcheon Photo 7
Location:
Dallas, TX
Work:

Mechanic

Mechanic

Jeremy Mccutcheon Photo 8
Location:
Dallas, TX
Work:
Don Davis Nissan
Mechanic

Phones & Addresses

Name
Addresses
Phones
Jeremy Mccutcheon
3416 Prestwick Square Dr, Jeffersonville, IN 47130
Jeremy Mccutcheon
3190 Spring Dr, Boyne Falls, MI 49713
231-535-6011
Jeremy W Mccutcheon
18215 S Mccone Ct, Continental, AZ 85629
Jeremy Mccutcheon
10846 Birch Dr, Joplin, MO 64804
Jeremy Mccutcheon
16995 County Road 8360, Rolla, MO 65401
573-308-5700
Jeremy Mccutcheon
1300 S 13Th St, Tecumseh, OK 74873
405-834-6632
Jeremy Mccutcheon
28 Owens Dr, Swanzey Center, NH 03446
Jeremy Mccutcheon
19 Bradford St, Charleston, WV 25301

Publications

Us Patents

Use Of Megasonic Energy To Assist Edge Bond Removal In A Zonal Temporary Bonding Process

US Patent:
2013006, Mar 14, 2013
Filed:
Sep 6, 2012
Appl. No.:
13/605657
Inventors:
Jeremy McCutcheon - Rolla MO, US
James E. Strothmann - Rolla MO, US
Assignee:
BREWER SCIENCE INC. - Rolla MO
International Classification:
B08B 3/12
US Classification:
134 1, 134184
Abstract:
New methods of weakening the bonds between a bonded pair of wafers or substrates are provided. The substrates are preferably bonded at their outer peripheries. When it is desired to separate the substrates, they are contacted with a solvent system suitable for weakening, softening, and/or dissolving the bonding composition at their outer peripheries. Megasonic energy is simultaneously directed at the substrates (and preferably the bonding composition itself), so as to increase solvent penetration into the composition, thus decreasing the time needed for substrate separation and increasing throughput.

Multiple Bonding Layers For Thin-Wafer Handling

US Patent:
2012003, Feb 9, 2012
Filed:
Aug 4, 2011
Appl. No.:
13/198294
Inventors:
Rama Puligadda - Rolla MO, US
Tony D. Flaim - St. James MO, US
Jeremy McCutcheon - Rolla MO, US
Assignee:
BREWER SCIENCE INC. - Rolla MO
International Classification:
B32B 27/32
B32B 7/02
B32B 27/40
B32B 27/36
B32B 27/00
H01L 21/30
B32B 27/38
US Classification:
428212, 438455, 428332, 428523, 428413, 428522, 428447, 4284744, 4284735, 4284231, 257E21211
Abstract:
Multiple bonding layer schemes that temporarily join semiconductor substrates are provided. In the inventive bonding scheme, at least one of the layers is directly in contact with the semiconductor substrate and at least two layers within the scheme are in direct contact with one another. The present invention provides several processing options as the different layers within the multilayer structure perform specific functions. More importantly, it will improve performance of the thin-wafer handling solution by providing higher thermal stability, greater compatibility with harsh backside processing steps, protection of bumps on the front side of the wafer by encapsulation, lower stress in the debonding step, and fewer defects on the front side.

Contact Planarization Apparatus

US Patent:
7775785, Aug 17, 2010
Filed:
Dec 20, 2006
Appl. No.:
11/613898
Inventors:
Jeremy W. McCutcheon - Rolla MO, US
Robert D. Brown - Rolla MO, US
Assignee:
Brewer Science Inc. - Rolla MO
International Classification:
B28B 1/00
B29C 35/08
US Classification:
4254051, 4251744
Abstract:
A contact planarization apparatus includes a lower membrane assembly, an upper membrane assembly, a differential pressure assembly, and a curing or reflowing assembly. The lower membrane assembly supports a substrate to be planarized and biases it toward the upper membrane assembly under the influence of the pressure differential assembly. The upper membrane assembly planarizes the coating on the substrate under the influence of the differential pressure assembly and includes a flexible sheet which is supported above the substrate stage and below the curing or reflowing assembly via a vacuum force applied by the differential pressure assembly. The differential pressure assembly moves the lower and upper membrane assemblies relative to one another to planarize the coating on the substrate entirely through the application of vacuum and pressure forces. The differential pressure assembly includes atop pressure chamber positioned above the upper face of the upper sheet, a bottom pressure chamber positioned below the lower face of the lower sheet, and a central pressure chamber positioned generally between the lower face of the upper sheet and the upper face of the lower sheet.

Method And Apparatus For Removing A Reversibly Mounted Device Wafer From A Carrier Substrate

US Patent:
2011030, Dec 22, 2011
Filed:
Jun 21, 2010
Appl. No.:
12/819680
Inventors:
Jeremy W. McCutcheon - Rolla MO, US
Robert D. Brown - Rolla MO, US
Assignee:
BREWER SCIENCE INC. - Rolla MO
International Classification:
B26D 5/42
B26D 3/28
US Classification:
156766, 156383
Abstract:
New demounting methods and apparatuses for separating temporarily, permanently, or semi-permanently bonded substrates and articles formed from those methods and apparatuses are provided. The methods comprise demounting a device wafer from a carrier wafer or substrate that have only been strongly bonded at their outer perimeters. The edge bonds are chemically, mechanically, acoustically, or thermally softened, dissolved, or disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process. A clamp for facilitating separation of the bonded substrates is also provided.

Method For Reversibly Mounting A Device Wafer To A Carrier Substrate

US Patent:
2011006, Mar 24, 2011
Filed:
Nov 22, 2010
Appl. No.:
12/951530
Inventors:
Tony D. Flaim - St. James MO, US
Jeremy McCutcheon - Rolla MO, US
Assignee:
BREWER SCIENCE INC. - Rolla MO
International Classification:
H05K 7/00
US Classification:
361807
Abstract:
New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in order to assist in protecting the device wafer and its device sites during subsequent processing and handling. The edge bonds formed by this method are chemically and thermally resistant, but can also be softened, dissolved, or mechanically disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process.

Automated Process And Apparatus For Planarization Of Topographical Surfaces

US Patent:
7790231, Sep 7, 2010
Filed:
Jul 8, 2004
Appl. No.:
10/887530
Inventors:
Jeremy McCutcheon - Rolla MO, US
Assignee:
Brewer Science Inc. - Rolla MO
International Classification:
B05D 3/12
B05D 3/06
US Classification:
427355, 427508, 427294
Abstract:
An improved apparatus () and method are provided for effective, high speed contact planarization of coated curable substrates such as microelectronic devices to achieve very high degrees of planarization. The apparatus () includes a planarizing unit () preferably having an optical flat flexible sheet () and a backup optical flat body (), and a curing assembly (). In operation, a substrate () having a planarizable coating () is placed within a vacuum chamber () beneath sheet () and body (). A pressure differential is created across sheet () so as to deflect the sheet into contact with a central region C of the coating (), whereupon the coating () is brought into full planarizing contact with sheet () and body () by means of a support () and vacuum chuck (); at this point the coating () is cured using assembly (). After curing, a pressure differential is established across sheet () for sequentially separating the sheet from the peripheral portion P of the coating, and then full separation of the sheet () and coating ().

Method For Reversibly Mounting A Device Wafer To A Carrier Substrate

US Patent:
2009021, Sep 3, 2009
Filed:
Jan 23, 2009
Appl. No.:
12/358951
Inventors:
Tony D. Flaim - St. James MO, US
Jeremy McCutcheon - Rolla MO, US
Assignee:
Brewer Science Inc. - Rolla MO
International Classification:
H01L 29/02
H01L 21/306
H01L 29/84
H01L 33/00
H01L 23/495
H01L 29/86
H01L 29/20
H01L 23/498
B32B 38/00
B32B 17/06
B32B 15/04
B32B 9/00
US Classification:
257 9, 438692, 438689, 257415, 257 88, 257666, 257528, 257615, 257737, 156278, 428426, 428457, 428446, 257E2123, 257E21219, 257E29324, 257E33001, 257E29002, 257E23031, 257E29325, 257E29089, 257E2306
Abstract:
New temporary bonding methods and articles formed from those methods are provided. The methods comprise bonding a device wafer to a carrier wafer or substrate only at their outer perimeters in order to assist in protecting the device wafer and its device sites during subsequent processing and handling. The edge bonds formed by this method are chemically and thermally resistant, but can also be softened, dissolved, or mechanically disrupted to allow the wafers to be easily separated with very low forces and at or near room temperature at the appropriate stage in the fabrication process.

Automated Process And Apparatus For Planarization Of Topographical Surfaces

US Patent:
2007010, May 10, 2007
Filed:
Jan 3, 2007
Appl. No.:
11/619484
Inventors:
Jeremy McCutcheon - Rolla MO, US
James Lamb - Rolla MO, US
International Classification:
H01L 21/461
US Classification:
438692000
Abstract:
An improved apparatus () and method are provided for effective, high speed contact planarization of coated curable substrates such as microelectronic devices to achieve very high degrees of planarization. The apparatus () includes a planarizing unit () preferably having an optical flat flexible sheet () and a backup optical flat body (), and a curing assembly (). In operation, a substrate () having a planarizable coating () is placed within a vacuum chamber () beneath sheet () and body (). A pressure differential is created across sheet () so as to deflect the sheet into contact with a central region C of the coating (), whereupon the coating () is brought into full planarizing contact with sheet () and body () by means of a support () and vacuum chuck (); at this point the coating () is cured using assembly (). After curing, a pressure differential is established across sheet () for sequentially separating the sheet from the peripheral portion P of the coating, and then full separation of the sheet () and coating ().

FAQ: Learn more about Jeremy Mccutcheon

What is Jeremy Mccutcheon's telephone number?

Jeremy Mccutcheon's known telephone numbers are: 603-903-0996, 405-834-6632, 520-840-3293, 603-933-0360, 904-602-5476, 903-825-1039. However, these numbers are subject to change and privacy restrictions.

How is Jeremy Mccutcheon also known?

Jeremy Mccutcheon is also known as: Jeremy D Mccutchoun, Jeremy D Mccutcheson, Jeremy D Mc, Jeremy M Cutcheon, Darlene Cobb, Gene Halstead. These names can be aliases, nicknames, or other names they have used.

Who is Jeremy Mccutcheon related to?

Known relatives of Jeremy Mccutcheon are: Jo Robinson, Karla Robinson, Lawrence Robinson, Wes Robinson, Carolyn Wines, Jeromy Jenkins, Michelle Hemsworth. This information is based on available public records.

What are Jeremy Mccutcheon's alternative names?

Known alternative names for Jeremy Mccutcheon are: Jo Robinson, Karla Robinson, Lawrence Robinson, Wes Robinson, Carolyn Wines, Jeromy Jenkins, Michelle Hemsworth. These can be aliases, maiden names, or nicknames.

What is Jeremy Mccutcheon's current residential address?

Jeremy Mccutcheon's current known residential address is: PO Box 287, Bullard, TX 75757. Please note this is subject to privacy laws and may not be current.

What are the previous addresses of Jeremy Mccutcheon?

Previous addresses associated with Jeremy Mccutcheon include: 18215 S Mccone Ct, Sahuarita, AZ 85629; 1300 S 13Th St, Tecumseh, OK 74873; 10 Hickory Rdg, Benton, AR 72019; 716 S Main St, Maquoketa, IA 52060; 26 Bluff Point Rdg, Waverly, TN 37185. Remember that this information might not be complete or up-to-date.

Where does Jeremy Mccutcheon live?

Bullard, TX is the place where Jeremy Mccutcheon currently lives.

How old is Jeremy Mccutcheon?

Jeremy Mccutcheon is 49 years old.

What is Jeremy Mccutcheon date of birth?

Jeremy Mccutcheon was born on 1974.

What is Jeremy Mccutcheon's email?

Jeremy Mccutcheon has such email addresses: brent.mccutch***@yahoo.com, skaterguy***@aol.com. Note that the accuracy of these emails may vary and they are subject to privacy laws and restrictions.

Possible Relatives

Cynthia Mccutcheon David Mccutcheon Dawn Mccutcheon Dale Mccutcheon Debbie Mccutcheon Deborah Mccutcheon Dan Mccutcheon Jeremy Stamps Jeremy Johnston Jeremy Stanfield

Jeremy Mccutcheon from other States

Texas California Michigan West Virginia Florida Tennessee North Carolina Indiana Massachusetts Alabama Arizona New Hampshire Georgia Iowa Pennsylvania Virginia Missouri

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