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Salman Akram

In the United States, there are 9 individuals named Salman Akram spread across 13 states, with the largest populations residing in Texas, California, New York. These Salman Akram range in age from 25 to 81 years old. Some potential relatives include Abdallah Noureddine, Akram Salman. You can reach Salman Akram through their email address, which is salman.ak***@gmail.com. The associated phone number is 313-460-5642, including 2 other potential numbers within the area code of 208. For a comprehensive view, you can access contact details, phone numbers, addresses, emails, social media profiles, arrest records, photos, videos, public records, business records, resumes, CVs, work history, and related names to ensure you have all the information you need.
Last updated Jan 15, 2024
Background search with BeenVerified
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Salman A Akram , Age 57
Pleasanton, CA
Also known as:
Salman Abida Akram
Salmen Akram
Salma N Akram
Akram Salman
Has lived in:
Pleasanton, CA
Boise, ID
Santa Clara, CA
Troy, NY
Related to:
Abida Akram, 45
Phone number:
208-867-****
PhoneAddress
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Salman Akram , Age 25
Woodhaven, NY
Has lived in:
Woodhaven, NY
Related to:
Akram Habib
PhoneAddress
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Salman M Akram , Age 81
New York, NY
Has lived in:
New York, NY
PhoneAddress
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Muhammad S Akram , Age 43
Tyngsboro, MA
Also known as:
Salman Akram
Mhammad S Akram
Muhammad Salman
Akram Muhammad
Has lived in:
Tyngsboro, MA
Portsmouth, NH
Chicopee, MA
Revere, MA
Related to:
Maryam Salman
PhoneAddress
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Salman A Ghauri , Age 45
McKinney, TX
Also known as:
Salman S Ghauri
Salman Akram
Mohammad S Akram
Akram G Salman
Has lived in:
McKinney, TX
Houston, TX
Sterling, VA
Cincinnati, OH
Related to:
Sameera Salman, 40
Fahmida Akram
Mohammad Akram
PhoneAddress
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Akram Salman , Age 50
Plano, TX
Also known as:
Maria Salman
Akran Salman
Akram Falman
Salman Akram
Has lived in:
Plano, TX
Thousand Oaks, CA
Canoga Park, CA
Chatsworth, CA
Related to:
Akram Salman
Abdallah Noureddine, 37
PhoneAddress
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Akram Salman , Age 44
Allen, TX
Also known as:
Salman Akram
Has lived in:
Allen, TX
McKinney, TX
Mc Kinney, TX
Dallas, TX
Related to:
Faiza Salman
PhoneAddress
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Akram I Salman , Age 61
Narvon, PA
Also known as:
Salman Akram
Has lived in:
Narvon, PA
Leola, PA
Lancaster, PA
Gresham, OR
PhoneAddress
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Akram Salman 
Henderson, NV
Also known as:
Salman Akram
Has lived in:
Henderson, NV
Las Vegas, NV
PhoneAddress
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Public information about Salman Akram

Resumes

Resumes

Program Manager

Salman Akram Photo 1
Location:
Houston, TX
Industry:
Automotive
Work:
Healthcare Client - Washington D.C. Metro Area since Jan 2013
Identity and Access Management Consultant Financial Company - Washington D.C. Metro Area Sep 2012 - Dec 2012
Identity and Access Management Consultant George Washington University - Washington D.C. Metro Area 2010 - Sep 2012
Tech Lead, Identity and Access Management Accenture 2009 - 2010
Senior Security Consultant American Bureau of Shipping Sep 2009 - Oct 2009
Application Security Architect Consultant NetApp Mar 2009 - Sep 2009
Identity Management Lead Consultant US Bank Feb 2008 - Feb 2009
Security Consultant Techdemocracy LLC - Edison, NJ 2006 - 2009
Identity and Access Management Consultant CSC Consulting Feb 2007 - Dec 2007
Security Lead State Farm Insurance Sep 2006 - Feb 2007
Security Analyst MasterCard Jul 2005 - Aug 2006
Identity and Access Management Consultant Reston Technology Group Jun 2004 - Jun 2005
Programmer Analyst ExecutiveBiz 2004 - 2004
Software Support Virginia Tech Aug 2002 - May 2004
Research Assistant Wolters Kluwer Oct 2001 - Apr 2002
Release Engineer
Education:
The George Washington University 2010 - 2014
Virginia Polytechnic Institute and State University 2002 - 2005
Wichita State University 2000 - 2001
National University of Computer and Emerging Sciences 1997 - 2000
Florida Air Academy 1993 - 1996
Skills:
Identity Management, Security, Siteminder, Ldap, Application Security, Web Services, Oracle Identity Manager, Java, Sso, Enterprise Architecture, Oracle, Iam, Security Policy, Solution Architecture, Databases, Oracle Access Manager, Identity Federation, Directory Services, Authentication, Rbac, Information Security Management, Unix, Oid, Information Security, Cissp, Soa, Identity and Access Management, Access Management, Provisioning, Service Oriented Architecture, It Security Policies
Certifications:
Information Technology Infrastructure Library (Itil) V3 Foundation
Itil
Certified Scrum Product Owner
Certified Scrum Master

Founder And Chief Executive Officer

Salman Akram Photo 2
Location:
Boston, MA
Industry:
Information Technology And Services
Work:
Rubik's Technologies
Founder and Chief Executive Officer Liberty Mutual Insurance Dec 2013 - Nov 2017
Bsa- Financial Systems T-Mobile Dec 2011 - Dec 2013
Business System Analyst Citi Aug 2009 - Dec 2011
Senior Business Analyst
Education:
University of Central Punjab
Master of Business Administration, Masters University of Central Punjab
Bachelors, Bachelor of Science, Computer Science Southern New Hampshire University
Master of Science, Masters, International Business
Skills:
Visio, Project Planning, Business Analysis, Leadership, Requirements Gathering, Sharepoint, Sdlc, Data Warehousing, Systems Analysis, Sas Programming, Gql, Essbase, Soapui, Hp Application Lifecycle Management

Owner, Paktel Inc

Salman Akram Photo 3
Location:
Greater Boston Area
Industry:
Wireless

Tech Lead, Identity And Access Management At The George Washington University

Salman Akram Photo 4
Location:
Washington D.C. Metro Area
Industry:
Information Technology and Services

Sap S And 4 Hana Senior Consultant

Salman Akram Photo 5
Location:
6940 Hartwell St, Dearborn, MI 48126
Industry:
Information Technology And Services
Work:
Deloitte Consulting
Sap S and 4 Hana Senior Consultant Hewlett-Packard Aug 1, 2016 - Apr 2017
Business Systems Ap Lead Hewlett-Packard Nov 2015 - Jul 2016
Sap S4 Hana on-Premise Poc Implementer Hewlett-Packard Jan 2015 - Oct 2015
Business Systems Interface Lead Hewlett-Packard Jan 2011 - Dec 2014
Business Systems Tax and Integration Lead Hewlett-Packard Jan 2010 - Dec 2010
Business Systems Architect Hewlett-Packard Apr 2007 - Dec 2009
Business Systems Development Lead Arco Ltd Sep 16, 2005 - Jan 31, 2007
Business Analyst Siemens Jan 2003 - Sep 2004
Sap Abap Consultant
Education:
Sheffield Hallam University 2004 - 2008
Master of Science, Masters, Management Sheffield Hallam University 2007
Masters Sheffield Hallam University 2002 - 2004
Master of Science, Masters Lahore University of Management Sciences 2003
Bachelors, Bachelor of Arts Lahore University of Management Sciences 1998 - 2002
Bachelors, Bachelor of Science, Computer Science National University of Computer and Emerging Sciences 1997 - 1998
Ucl (University College Lahore) 1995 - 1997
Aitchison College 1990 - 1995
Skills:
Integration, Business Intelligence, Business Process, Business Analysis, Abap, Sap, Data Migration, Sap R/3, Sap Implementation, Sap Erp, Requirements Analysis, Erp, Project Management, Solution Architecture, Sap Bw, Data Modeling, Sql, Crm, Vendor Management, Sap Fi, Sap Xi, Idoc, Sd, Data Warehousing, Business Objects, Java, Itil, Sap Portal, Testing, User Acceptance Testing, Sap Netweaver, Requirements Gathering, Bapi, Agile Methodologies, Software Documentation, Unix, Databases, Sapscript, Sap Bi
Languages:
Urdu
Punjabi
Hindi
English
Certifications:
Open Sap Academy on Hana Implementation
Sap Abap
Sap Sd
Sap Sem

Assistant Vice President - Consultant Application Programming

Salman Akram Photo 6
Location:
1640 Van Ness Ave, San Francisco, CA 94109
Industry:
Non-Profit Organization Management
Work:
Bank of America
Assistant Vice President - Consultant Application Programming Contrywide Apr 2001 - Sep 2008
Senior Software Developer A Non-Profit Organization. Apr 2001 - Sep 2008
Office 365 and Audio and Video Streaming Administrator
Education:
University of the Punjab 1992 - 1994
Bachelors, Bachelor of Science, Statistics, Physics Pilot Secondary School
Skills:
Sdlc, Soa, Web Services, Requirements Analysis, Software Project Management, Agile Methodologies, Business Analysis, Microsoft Sql Server, Sql, Software Development, Db2, Xml, Asp.net, C#, .Net, Java Enterprise Edition, Oracle, Pl/Sql, Sharepoint, T Sql, Websphere
Certifications:
Aws Certified Solutions Architect (Associate)
Certified Rpgle Developer
Certified Java 2 Developer
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Data provided by Veripages

Publications

Us Patents

Device And Method For Electrically Or Thermally Coupling To The Backsides Of Integrated Circuit Dice In Chip-On-Board Applications

US Patent:
6339256, Jan 15, 2002
Filed:
Jan 5, 1999
Appl. No.:
09/225278
Inventors:
Salman Akram - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L 2352
US Classification:
257691, 257680, 257700, 257720
Abstract:
An inventive printed circuit board for chip-on-board applications has a ground plane that is externally exposed through apertures in any overlying layers in the board so the backside surface of a bare integrated circuit die can be directly attached to the ground plane using a silver-filled epoxy. As a result, heat is conducted away from the die through the ground plane. Also, a substrate bias voltage can be supplied to the backside surface of the die through the ground plane to eliminate the need for an internal substrate bias to the die, and to eliminate the need for a substrate bias voltage bond pad on the front-side surface of the die.

Thin Film Capacitor Coupons For Memory Modules And Multi-Chip Modules

US Patent:
6342724, Jan 29, 2002
Filed:
Sep 25, 2000
Appl. No.:
09/668853
Inventors:
James M. Wark - Boise ID
Salman Akram - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L 2900
US Classification:
257532, 257924, 438108, 438393, 438396
Abstract:
A semiconductor device including a thin capacitor coupon mounted to the backside of a semiconductor die. When mounted active surface up on a carrier substrate of a multi-chip module, the coupon is secured between the backside of the die and the substrate. When flip-chip connections or direct chip attach are employed between the die and substrate, the coupon is secured to the backside of the die. The coupons may be preformed, or formed on the die in a wafer-scale fabrication process prior to singulation of the dice.

Method For Fabricating A Simplified Cmos Polysilicon Thin Film Transistor And Resulting Structure

US Patent:
6335230, Jan 1, 2002
Filed:
Jan 4, 2000
Appl. No.:
09/477203
Inventors:
Salman Akram - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L 2100
US Classification:
438149, 438151, 438154, 438197, 438353, 438355, 438405, 438412
Abstract:
A method of forming a MOS device using doped and activated n-type and p-type polysilicon layers wherein a first doped and activated polysilicon layer (either n-type and p-type) is patterned on a substrate. An isolation material layer is formed abutting the first doped and activated polysilicon layer in the corners formed at the junction between the first doped and activated polysilicon layer and the substrate. A second doped and activated polysilicon layer (either n-type or p-type) is applied over the first doped and activated polysilicon layer and the isolation material layer. The second doped and activated polysilicon layer is planarized to the height of the first doped and activated polysilicon layer. The first and second doped and activated polysilicon layers are etched to substantially bifurcate the first and second doped and activated polysilicon layers. Further processing steps known in the art are utilized to complete the MOS device.

Testing System For Evaluating Integrated Circuits, A Burn-In Testing System, And A Method For Testing An Integrated Circuit

US Patent:
6349396, Feb 19, 2002
Filed:
Dec 21, 2000
Appl. No.:
09/745834
Inventors:
Salman Akram - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G01R 3128
US Classification:
714724, 714734, 324765
Abstract:
A burn-in testing system for evaluating a circuit under test, the system including a burn-in board having a plurality of receptacles, at least one of which being sized to receive the circuit under test, test interface circuitry supported by the board and coupled to the receptacles, the test interface circuitry including a transmitter and receiver; power conductors supported by the board, coupled to the receptacles and configured to be connected to a power supply to power the circuit under test during burn-in testing, control and data signal conductors, a burn-in oven having a compartment selectively receiving the burn-in board and being configured to apply heat within the compartment, and an interrogator unit supported by the burn-in oven, the interrogator unit being configured to send commands to the test interface circuitry to exercise the circuit under test optically or via radio communication and to receive responses to the commands optically or via radio communication. A method for testing an integrated circuit having operational circuitry formed thereon, optically and via radio frequency.

Multiple Die Stack Apparatus Employing T-Shaped Interposer Elements

US Patent:
6351028, Feb 26, 2002
Filed:
Feb 8, 1999
Appl. No.:
09/247009
Inventors:
Salman Akram - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
H01L 2302
US Classification:
257686, 257732, 257777
Abstract:
Multiple integrated circuit devices in a stacked configuration that uses a spacing element for allowing increased device density and increased thermal conduction or heat removal for semiconductor devices and the methods for the stacking thereof.

Methods Of Testing Integrated Circuitry, Methods Of Forming Tester Substrates, And Circuitry Testing Substrates

US Patent:
6337575, Jan 8, 2002
Filed:
Dec 23, 1998
Appl. No.:
09/221216
Inventors:
Salman Akram - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G01R 1073
US Classification:
324760, 324757
Abstract:
A method of testing integrated circuitry includes providing a substrate comprising integrated circuitry to be tested. The circuitry substrate to be tested has a plurality of exposed conductors in electrical connection with the integrated circuitry. In one implementation, at least some of the exposed conductors of the circuitry substrate are heated to a temperature greater than 125Â C. and within at least 50% in degrees centigrade of and below the melting temperature of the exposed conductors of the circuitry substrate. In one implementation, such are heated to a temperature below their melting temperature yet effective to soften said at least some of the exposed conductors to a point enabling their deformation upon application of less than or equal to 30 grams of pressure per exposed conductor. The circuitry substrate is engaged with a tester substrate. The tester substrate has a plurality of exposed conductors at least some of which are positioned to align with exposed conductors of the circuitry substrate.

Test Carrier With Molded Interconnect For Testing Semiconductor Components

US Patent:
6353326, Mar 5, 2002
Filed:
Aug 28, 1998
Appl. No.:
09/143300
Inventors:
David R. Hembree - Boise ID
Salman Akram - Boise ID
Warren M. Farnworth - Nampa ID
Alan G. Wood - Boise ID
Derek Gochnour - Boise ID
John O. Jacobson - Boise ID
James M. Wark - Boise ID
Syed Sajid Ahmad - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G01R 3102
US Classification:
324755, 324765
Abstract:
A semiconductor carrier for testing semiconductor components, such as bare dice and chip scale packages, and a method for fabricating the carrier are provided. The carrier includes a molded plastic base, a lead frame, and an interconnect. The interconnect includes contacts for making temporary electrical connections with corresponding contacts (e. g. , bond pads, solder balls) on the components. The carrier is fabricated by attaching the interconnect to the lead frame, and then molding the plastic base to the interconnect and lead frame. An alternate embodiment carrier includes a board to which multiple interconnects are molded or laminated. In addition, clip members retain the components on the board in electrical communication with the interconnects.

Test System With Mechanical Alignment For Semiconductor Chip Scale Packages And Dice

US Patent:
6353328, Mar 5, 2002
Filed:
Dec 20, 2000
Appl. No.:
09/745093
Inventors:
Salman Akram - Boise ID
Warren M. Farnworth - Nampa ID
David R. Hembree - Boise ID
Assignee:
Micron Technology, Inc. - Boise ID
International Classification:
G01R 3102
US Classification:
324758, 324765, 324755
Abstract:
A test system for testing semiconductor components, such as bumped dice and chip scale packages, is provided. The test system includes a base for retaining one or more components, and an interconnect for making temporary electrical connections with the components. The test system also includes an alignment fixture having an alignment surface for aligning the components to the interconnect. In addition, the components can include alignment members, such as beveled edges, bumps, or posts configured to interact with the alignment surface. The alignment fixture can be formed as a polymer layer, such as a layer of resist, which is deposited, developed and then cured using a wafer level fabrication process. The alignment surface can be an opening in the polymer layer configured to engage edges of the components, or alternately to engage the alignment members.

FAQ: Learn more about Salman Akram

Where does Salman Akram live?

Pleasanton, CA is the place where Salman Akram currently lives.

How old is Salman Akram?

Salman Akram is 57 years old.

What is Salman Akram date of birth?

Salman Akram was born on 1966.

What is Salman Akram's email?

Salman Akram has email address: salman.ak***@gmail.com. Note that the accuracy of this email may vary and this is subject to privacy laws and restrictions.

What is Salman Akram's telephone number?

Salman Akram's known telephone numbers are: 313-460-5642, 208-867-7278. However, these numbers are subject to change and privacy restrictions.

How is Salman Akram also known?

Salman Akram is also known as: Salman Abida Akram, Salmen Akram, Salma N Akram, Akram Salman, Akram Salmen. These names can be aliases, nicknames, or other names they have used.

Who is Salman Akram related to?

Known relative of Salman Akram is: Abida Akram. This information is based on available public records.

What are Salman Akram's alternative names?

Known alternative name for Salman Akram is: Abida Akram. This can be alias, maiden name, or nickname.

What is Salman Akram's current residential address?

Salman Akram's current known residential address is: 6940 Hartwell St, Dearborn, MI 48126. Please note this is subject to privacy laws and may not be current.

What are the previous addresses of Salman Akram?

Previous addresses associated with Salman Akram include: 10025 De Soto Ave, Chatsworth, CA 91311; 555 Laurie Ln, Thousand Oaks, CA 91360; 1463 Regatta, Boise, ID 83706; 2917 Falling Brook, Plano, TX 75023; 6705 Tawny Oak, Plano, TX 75024. Remember that this information might not be complete or up-to-date.

Possible Relatives

A Akram D Akram Daniel Akram Deloise Akram E Akram El Akram Elias Akram Salman Kahn Salman Karim Salman Khan Salman Khawaja Salman Mirza Salman Moe Salman Mohammad

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