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Mark Courtney

In the United States, there are 353 individuals named Mark Courtney spread across 47 states, with the largest populations residing in Texas, California, Missouri. These Mark Courtney range in age from 50 to 75 years old. Some potential relatives include Barbara Courtney, Kyle Yellseagle, John Courtney. You can reach Mark Courtney through various email addresses, including mark.court***@ibm.net, mark.court***@hotmail.com, bitl***@aol.com. The associated phone number is 410-243-9353, along with 6 other potential numbers in the area codes corresponding to 804, 515, 714. For a comprehensive view, you can access contact details, phone numbers, addresses, emails, social media profiles, arrest records, photos, videos, public records, business records, resumes, CVs, work history, and related names to ensure you have all the information you need.

Public information about Mark Courtney

Resumes

Resumes

Computer Software Professional

Mark Courtney Photo 1
Location:
429 Chestnut Dr, Lockport, NY 14094
Industry:
Computer Software
Work:
Vrd Design
Computer Software Professional Microsoft Sep 1991 - Nov 2006
Business Unit Manager
Education:
Dublin City University
Languages:
English

Field Service Manager

Mark Courtney Photo 2
Location:
2990 Summit Sky Blvd, Eugene, OR 97405
Industry:
Industrial Automation
Work:
Coe Manufacturing Mar 1980 - Oct 1995
Project Engineer Ventek Mar 1980 - Oct 1995
Field Service Manager Morvue Electronics May 1978 - Mar 1980
Production Test
Skills:
Plc, Instrumentation, Engineering, Automation, Electricians, Preventive Maintenance, Field Service, Control Systems Design, Manufacturing, Pneumatics, Scada, Commissioning, Robotics, Electronics, Allen Bradley, Variable Frequency Drives, Continuous Improvement
Languages:
English

Senior Vice President And Digital Group Product Manager

Mark Courtney Photo 3
Location:
Kansas City, MO
Industry:
Banking
Work:
UMB since Aug 2007
Cash Managemet Product Manager Central Bancompany Apr 2000 - May 2005
Director of e-Commerce Boone County National Bank Jan 1995 - Apr 2000
Technology Officer
Education:
University of Missouri-Columbia 1993 - 1994
MBA University of Missouri-Columbia 1988 - 1993
BSBA, Finance
Skills:
Product Management, Banking, Risk Management, Payments, Vendor Management, Strategic Planning, Requirements Analysis, Internet Banking, Electronic Payments, Business Analysis, Public Speaking, Training Delivery, Usability Design
Interests:
Pet Rescue
User Interface Design
Politics
Online Payments
System Integration
Healthy Cooking
Certifications:
Certified Treasury Professional

Production Operations Manager

Mark Courtney Photo 4
Location:
Grapevine, TX
Industry:
Machinery
Work:
Glass Master Corp Sep 1979 - Jul 2015
Production Operations Manager
Education:
Theodore Roosevelt Hs San Antonio, Tx
Skills:
Product Development, Operations Management, Quality Control, Problem Solving, Purchasing, Product Management, Customer Service, Proven Leadership, Sales

Sales Director

Mark Courtney Photo 5
Location:
2933 Symmes Rd, Fairfield, OH 45014
Industry:
Mechanical Or Industrial Engineering
Work:
Howden North America Inc.
Sales Director - Petrochem, Oil and Gas, North America Howden North America Inc. Jun 2012 - May 2014
Power Team Sales Leader - Aftermarket Howden Covent Fans Jun 2012 - May 2014
Director of Sales Howden North America Inc. Jan 2011 - Jun 2012
Industrial Team Sales Leader - Aftermarket Itt Enidine 1999 - 2008
Sales and Product Line Manager 1999 - 2008
Sales Director
Education:
Rochester Institute of Technology 1983 - 1988
Bachelors, Energy, Engineering Mechanicsburg Area Senior High 1980 - 1983
Skills:
Continuous Improvement, Engineering, Manufacturing, Sales, Lean Manufacturing, Product Development, Strategic Planning, Management, Contract Negotiation, Project Management, Marketing, Mechanical Engineering, Leadership, Process Improvement, Sales Management, Negotiation, New Business Development, Customer Service, Business Strategy, International Sales, Energy, Change Management, Kaizen, Team Building, Budgets, Business Process Improvement, Team Leadership, Counselor Selling, International Business, Cross Functional Team Leadership, Key Account Management, Product Management, Competitive Analysis, Executive Management, Coaching, Root Cause Analysis, Strategic Partnerships, P&L Management, Public Speaking, Valves, Solenoid Valves
Interests:
Health

Vice President Of Supply Chain

Mark Courtney Photo 6
Location:
Spokane, WA
Industry:
Electrical/Electronic Manufacturing
Work:
Amphenol Telect Apr 2015 - Sep 2015
Erp and Business Operations Manager Amphenol Telect Aug 2007 - Sep 2015
Supply Chain Manager Honeywell Mar 2007 - Aug 2007
Senior Buyer and Planner Mrv Communications Jun 2005 - Mar 2006
Purchasing Manager Arrow Electronics May 2000 - Jun 2005
Sales Associate Apogee Electronics Oct 1999 - May 2000
Purchasing Manager Alesis Studio Electronics Oct 1991 - Oct 1999
Purchasing Manager Keytronicems Oct 1991 - Oct 1999
Vice President of Supply Chain
Skills:
Purchasing, Cross Functional Team Leadership, Supply Chain, Supply Chain Management, Manufacturing, Mrp, Product Development, Process Improvement, Continuous Improvement, Supply Management, Lean Manufacturing, Materials Management, Management, Procurement, Operations Management, Project Planning, Inventory Management, Global Sourcing, Product Management, Erp, Contract Negotiation, Forecasting, Program Management, Root Cause Analysis, Strategic Planning, Logistics, Sourcing, Material Requirements Planning, Quality Management, Contract Manufacturing, Sap, Project Management, Pricing, Business Process Improvement, Strategic Sourcing, Process Engineering, Value Stream Mapping, Manufacturing Operations Management, Inventory Control, Engineering, Vendor Management, Enterprise Resource Planning, Analysis, Sql Server Management Studio

Architect And Project Manager

Mark Courtney Photo 7
Location:
406 south Boulder Ave, Tulsa, OK 74103
Industry:
Architecture & Planning
Work:
Ksq Design
Architect and Project Manager Benham, A Haskell Company Nov 2006 - Aug 2011
Architect Sparks-Aei Tulsa Dec 1995 - Apr 2003
Architect Bsw International 1989 - 1996
Architect
Education:
Oklahoma State University Stillwater 1970 - 1975
Bachelors, Bachelor of Science, Architecture Bartlesville Sooner High School 1968 - 1970
Oklahoma State University
Skills:
Submittals, Architectural Design, Design Research, Sustainable Design, Architectures, Construction, Bim, Construction Drawings, Autocad, Architecture, Revit, Mixed Use, Leed Ap, Leed, Autocad Architecture, Comprehensive Planning, Architectural Drawings, Auto Cadd, Certified Building Plans Examiner

Respiratory Therapist

Mark Courtney Photo 8
Location:
Springfield, IL
Industry:
Non-Profit Organization Management
Work:
American Lung Association
Respiratory Therapist Illinois Central College Aug 1985 - Aug 1988
Respiratory Therapy Instructor Methodist Medical Center Jul 1984 - Aug 1988
Respiratory Therapist Memorial Medical Center Jul 1984 - Aug 1988
Respiratory Therapist
Education:
Lincoln Land Community College 1982 - 1984
Associates, Associate of Arts
Skills:
Nonprofits, Health Education, Public Health, Healthcare, Patient Education, Clinical Research, Critical Care, Healthcare Management, Hospitals, Program Development, Health Promotion, Pediatrics, Patient Safety, Community Outreach, Public Speaking, Fundraising, Emr, Nursing, Direct Patient Care
Certifications:
License 194002766
Certified Asthma Educator
Neonatal Pediatric Specialist
Registered Respiratory Therapist
License 09-13-023P
Respiratory Care Practitioner
Certified Tobacco Treatment Specialist
Background search with BeenVerified
Data provided by Veripages

Phones & Addresses

Name
Addresses
Phones
Mark & Courtney Powell
410-632-2703
Mark & Courtney Roberts
434-974-7454
Mark & Courtney J. Donovan
410-243-9353, 410-583-9409
Mark & Courtney Sherry
540-752-0521
Mark & Courtney Skeen
843-785-3862
Mark & Courtney Battista
804-739-8716
Mark & Courtney Story
303-471-5773
Mark & Courtney Thompson
515-963-0934
Mark Courtney
608-289-9764
Mark Courtney
704-907-1047
Mark Courtney
317-401-1072
Mark Courtney
812-454-4789
Mark Courtney
347-836-8946
Mark Courtney
706-398-1487
Mark Courtney
775-629-9381

Business Records

Name / Title
Company / Classification
Phones & Addresses
Mark S Courtney
Director, President
SHOWDOG, INC
Whol Nondurable Goods
1109 Hillview Dr, Keller, TX 76248
817-337-1478
Mark M. Courtney
Vice-President
Imperial Plastics, Incorporated
Mfg Plastic Products
336 E Industrial St, Kasota, MN 56050
PO Box 8, Kasota, MN 56050
507-931-4525
Mark Courtney
Owner
Millers Picnic Supply
Convenience Stores
137 S 5Th St #B, Collinsville, OK 74021
Mark Courtney
Vice-President
Acme Electric Heating Corp
Heating & Equip
13405 W 75 Ct, Shawnee Mission, KS 66216
Mark Courtney
Principal
Kevin L Courtney
Ret Hardware
702 N Fern St, Orange, CA 92867
Mark Courtney
Courtney Tax Services
Tax Return Preparation
2311 170Th St, Guthrie Center, IA 50115
515-729-7102
Mark Courtney
Principal
Lynchburg Regional Airport-Preston Glenn Field (Lyh)
Airport/Airport Services
350 Terminal Dr, Lynchburg, VA 24502
Mark Courtney
Principal
Mark Courtney
Business Services at Non-Commercial Site
821 Gray Rd, Rising Fawn, GA 30738

Publications

Us Patents

Environmentally Secure And Thermally Efficient Heat Sink Assembly

US Patent:
4715430, Dec 29, 1987
Filed:
Oct 27, 1986
Appl. No.:
6/923456
Inventors:
Allen J. Arnold - La Grangeville NY
Mark G. Courtney - Poughkeepsie NY
Diane N. Kirby - Poughkeepsie NY
Katherine H. Mis - Poughkeepsie NY
Kerry L. Sutton - Wappingers Falls NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 2340
US Classification:
165 803
Abstract:
A heat sink is disclosed for cooling a module having a plurality of chip sites thereon. The heat sink includes a frame member which is made of a material having a coefficient of thermal expansion which is substantially that of the substrate to which it is bonded. The frame has a plurality of fins disposed around the perimeter and a support surface disposed inside the perimeter fins. An insert member made of a high thermal conductivity material rests on the support surface. The insert member has a plurality of fins disposed on one side thereof and a plurality of projections on the other side. Forced air flowing around the fins provides a mechanism for rapidly removing heat therefrom. Each of the projections is disposed above a chip site and extends almost into contact with the upper surface of a chip mounted on the module substrate. A thermal paste is used to transfer heat directly from the chip to the insert member hence a mechanism is provided for rapidly removing heat developed in each chip of the module.

Electrical Interconnection Package And Method Thereof

US Patent:
6333563, Dec 25, 2001
Filed:
Jun 6, 2000
Appl. No.:
9/587944
Inventors:
Raymond A. Jackson - Fishkill NY
Anson J. Call - Poughkeepsie NY
Mark G. Courtney - Poughkeepsie NY
Stephen A. DeLaurentis - Claverack NY
Mukta S. Farooq - Hopewell Junction NY
Shaji Farooq - Hopewell Junction NY
Lewis S. Goldmann - Bedford NY
Gregory B. Martin - Wappingers Falls NY
Sudipta K. Ray - Wappingers Falls NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 2940
US Classification:
257778
Abstract:
The present invention relates generally to an electrical interconnection package and a method thereof. More particularly, the invention encompasses an invention that increases the fatigue life of a Ball Grid Array (BGA) electrical interconnection. This invention structurally couples at least one module to an organic interposer using a high modulus underfill material. The organic interposer is then joined to a organic board using standard joining processes. The inventive module can then be removed from the organic board at any time by moving the organic interposer using standard rework techniques.

Method And Apparatus For Interim Assembly Electrical Testing Of Circuit Boards

US Patent:
6552529, Apr 22, 2003
Filed:
Dec 17, 2001
Appl. No.:
10/022270
Inventors:
Benjamin V. Fasano - New Windsor NY
Mark G. Courtney - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01R 2708
US Classification:
3241581, 324715, 438 12
Abstract:
A method and a structure for assembling a circuit board whereby high temperature attach devices can be electrically tested prior to the joining of permanent low temperature attach devices. A test interposer, with low temperature attach known good reference devices, is placed in electrical contact with the circuit board containing high temperature attach devices. The test interposer/circuit board assembly can be used to identify any defective high temperature attach devices which can be replaced prior to joining the permanent low temperature attach devices on the circuit board. This partial interim test, when only the high temperature attach devices are mounted on the circuit board, eliminates the need to remove known good low temperature attach devices from the circuit board during the high temperature attach device rework process.

Apparatus For Cooling Of Chips Using Blind Holes With Customized Depth

US Patent:
5757620, May 26, 1998
Filed:
Aug 2, 1996
Appl. No.:
8/690884
Inventors:
David Linn Edwards - Poughkeepsie NY
Mark Gerard Courtney - Poughkeepsie NY
Albert Joseph Fahey - Pasadena CA
Gregory Scott Hopper - Fishkill NY
Sushumna Iruvanti - Wappingers Falls NY
Charles Frederick Jones - Poughkeepsie NY
Gaetano Paolo Messina - Hopewell Junction NY
Raed A. Sherif - Hopewell Junction NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 720
US Classification:
361705
Abstract:
The present invention relates generally to a new apparatus and method for customized cooling of chips. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by varying the depth of thermal compound filled gap or the blind hole that is above each chip.

Multi-Layer Solder Seal Band For Semiconductor Substrates And Process

US Patent:
5881945, Mar 16, 1999
Filed:
Apr 30, 1997
Appl. No.:
8/846935
Inventors:
David L. Edwards - Poughkeepsie NY
Armando S. Cammarano - Hyde Park NY
Jeffrey T. Coffin - Pleasant Valley NY
Mark G. Courtney - Poughkeepsie NY
Stephen S. Drofitz - Wappingers Falls NY
Michael J. Ellsworth - Poughkeepsie NY
Lewis S. Goldmann - Bedford NY
Sushumna Iruvanti - Wappingers Falls NY
Frank L. Pompeo - Montgomery NY
William E. Sablinski - Beacon NY
Raed A. Sherif - Croton NY
Hilton T. Toy - Wappingers Falls NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B23K 3102
B23K 3522
US Classification:
2281246
Abstract:
The present invention relates generally to a new scheme of providing a seal band for semi-conductor substrates and chip carriers. More particularly, the invention encompasses a structure and a method that uses a multi-layer metallic seal to provide protection to chips on a chip carrier. This multi-layer metal seal provides both enhanced hermeticity lifetime and environmental protection. For the preferred embodiment the multi-layer metallic seal band is a three layer, solder sandwich structure which is used to create a low cost, high reliability, hermetic seal for the module. This solder sandwich has a high melting temperature thick solder inner core, and lower melting point thin interconnecting solder layers, where the thin interconnecting solder layers may have similar or different melting points.

Conductive Polymer Interconnection Configurations

US Patent:
6858111, Feb 22, 2005
Filed:
Jul 23, 2001
Appl. No.:
09/911069
Inventors:
Charles H. Perry - Poughkeepsie NY, US
Mark G. Courtney - Poughkeepsie NY, US
Lewis S. Goldmann - Bedford NY, US
Gregory B. Martin - Wappingers Falls NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
C09J005/00
US Classification:
156327, 1563077, 257737, 438614
Abstract:
A method of forming an electrical connection between two devices is disclosed. In an exemplary embodiment of the invention, the method includes soldering a second solderable cap of an interconnection to a first contact pad of a first component. The interconnection further includes a conductive polymer comprising a polymer component and a conductive component A first solderable cap is disposed in contact with the conductive polymer, and the second solderable cap is disposed in contact with the conductive polymer opposite the first solderable cap. The first solderable cap is then soldered to a second contact pad of a second component.

Solder Disc Connection

US Patent:
6070321, Jun 6, 2000
Filed:
Jul 9, 1997
Appl. No.:
8/890458
Inventors:
Peter J. Brofman - Hopewell Junction NY
Patrick A. Coico - Fishkill NY
Mark G. Courtney - Poughkeepsie NY
Lewis S. Goldmann - Bedford NY
Raymond A. Jackson - Fishkill NY
William E. Sablinski - Beacon NY
Kathleen A. Stalter - Hopewell Junction NY
Hilton T. Toy - Wappingers Falls NY
Li Wang - Poughkeepsie NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 334
US Classification:
29840
Abstract:
A solder preform is provided for forming interconnections between multilayer ceramic substrates comprising an upper layer and lower layer of solder separated by an intermediate layer of a material which is wettable by solder and which does not melt at the temperatures used to reflow the solder and form the connections. The solder preform is used to join the substrates and is particularly useful to simultaneously electrically interconnect the substrates and to form a hermetic seal between the substrates being joined.

Method And Apparatus For Cooling Of Chips Using A Plurality Of Customized Thermally Conductive Materials

US Patent:
5724729, Mar 10, 1998
Filed:
Apr 15, 1996
Appl. No.:
8/632718
Inventors:
Raed A. Sherif - Hopewell Junction NY
Mark Gerard Courtney - Poughkeepsie NY
David Linn Edwards - Poughkeepsie NY
Albert Joseph Fahey - Pasadena CA
Gregory Scott Hopper - Fishkill NY
Sushumna Iruvanti - Wappingers Falls NY
Charles Frederick Jones - Poughkeepsie NY
Gaetano Paolo Messina - Hopewell Junction NY
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H05K 334
US Classification:
29840
Abstract:
The present invention relates generally to a new apparatus and method for customized cooling of chips using a plurality of thermally conductive materials. More particularly, the invention encompasses an apparatus and a method that provides customized cooling of a MCM (Multi-Chip Module) by using a plurality of thermally conductive materials.

FAQ: Learn more about Mark Courtney

What are the previous addresses of Mark Courtney?

Previous addresses associated with Mark Courtney include: 115 Forrest Lake Rd, Alpharetta, GA 30022; 3432 Havalyn Ln, Atlanta, GA 30340; 612 Cimarron Pkwy, Atlanta, GA 30350; 621 Cimarron Pkwy, Atlanta, GA 30350; 9930 Barston Ct, Alpharetta, GA 30022. Remember that this information might not be complete or up-to-date.

Where does Mark Courtney live?

Cincinnati, OH is the place where Mark Courtney currently lives.

How old is Mark Courtney?

Mark Courtney is 60 years old.

What is Mark Courtney date of birth?

Mark Courtney was born on 1964.

What is Mark Courtney's email?

Mark Courtney has such email addresses: mark.court***@ibm.net, mark.court***@hotmail.com, bitl***@aol.com, courtneyh***@cinci.rr.com, su***@uswest.net, mark.court***@yahoo.com. Note that the accuracy of these emails may vary and they are subject to privacy laws and restrictions.

What is Mark Courtney's telephone number?

Mark Courtney's known telephone numbers are: 410-243-9353, 410-583-9409, 804-739-8716, 515-987-9089, 714-731-2628, 813-289-4225. However, these numbers are subject to change and privacy restrictions.

How is Mark Courtney also known?

Mark Courtney is also known as: Mrak Courtney, Courtney Mrak. These names can be aliases, nicknames, or other names they have used.

Who is Mark Courtney related to?

Known relatives of Mark Courtney are: Sarah Allen, Craig Allen, Gregory Courtney, Julia Courtney, Maureen Courtney, Connor Courtney, Courtney Hvac. This information is based on available public records.

What are Mark Courtney's alternative names?

Known alternative names for Mark Courtney are: Sarah Allen, Craig Allen, Gregory Courtney, Julia Courtney, Maureen Courtney, Connor Courtney, Courtney Hvac. These can be aliases, maiden names, or nicknames.

What is Mark Courtney's current residential address?

Mark Courtney's current known residential address is: 1635 Clayton Ave, Cincinnati, OH 45206. Please note this is subject to privacy laws and may not be current.

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