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Aparna Prabhakar

In the United States, there are 10 individuals named Aparna Prabhakar spread across 8 states, with the largest populations residing in California, New Jersey, New York. These Aparna Prabhakar range in age from 42 to 64 years old. Some potential relatives include Ritu Gandhi, Franklin Lee, Ji Chung. You can reach Aparna Prabhakar through various email addresses, including lan***@gotpaintball.com, cor***@parsimail.com, aprabha***@yahoo.com. The associated phone number is 914-218-8196, along with 5 other potential numbers in the area codes corresponding to 312, 732, 858. For a comprehensive view, you can access contact details, phone numbers, addresses, emails, social media profiles, arrest records, photos, videos, public records, business records, resumes, CVs, work history, and related names to ensure you have all the information you need.

Public information about Aparna Prabhakar

Resumes

Resumes

Intern

Aparna Prabhakar Photo 1
Location:
San Jose, CA
Work:
Rishi Kumar For Congress
Intern

Aparna Prabhakar

Aparna Prabhakar Photo 2
Location:
United States

Director, Product Marketing And Public Relations

Aparna Prabhakar Photo 3
Location:
New York, NY
Industry:
Hospital & Health Care
Work:
Mmodal
Director, Product Marketing and Public Relations Cbay Systems (I) Pvt. Ltd. 2009 - 2012
Director, Marketing
Education:
St. Xavier's College
Bachelors, Bachelor of Science
Skills:
Marketing Strategy, Gifted Story Teller, Communications Skills, Product Marketing, Exceptional Story Telling Skills, Writing and Editing

Aparna Prabhakar

Aparna Prabhakar Photo 4

Aparna Prabhakar

Aparna Prabhakar Photo 5

Indian Classical Dance And Montessori

Aparna Prabhakar Photo 6
Location:
San Diego, CA
Industry:
Fine Art
Work:

Indian Classical Dance and Montessori Swapanthi Dance Academy
Indian Classical Dance and Montessori Teacher
Education:
Swapanthi Dance Academy

Partner, Corporate Strategy

Aparna Prabhakar Photo 7
Location:
New York, NY
Industry:
Management Consulting
Work:
Ibm
Partner, Corporate Strategy
Education:
Mit Sloan School of Management 2016 - 2018
Master of Business Administration, Masters
Skills:
Physics, Photovoltaics, Hardware Architecture, Engineering Management, Analog Circuit Design, Photolithography, Scanning Electron Microscopy, Matlab, Microprocessors, Sensors, Electroplating, Mems, Electronics, Asic, Analog, Vlsi, Verilog, Materials, Engineering, Thin Films, Strategy, Characterization, Signal Processing, Process Integration, Mixed Signal, Cmos, Marketing, Testing, Semiconductor Industry, Microfabrication, Cross Functional Team Leadership, Labview, Design of Experiments, Soc, Eda, Failure Analysis, Semiconductors, Simulations, Project Management, Process Engineering, Spc, Metrology, Pre Sales, R&D, Process Simulation, Materials Science, Nanotechnology, Ic
Interests:
Science and Technology
Children
Education
Languages:
English
Hindi
Kannada
Certifications:
Pmp

Notre Dame High School, San Jose

Aparna Prabhakar Photo 8
Location:
San Jose, CA
Work:

Notre Dame High School, San Jose

Phones & Addresses

Name
Addresses
Phones
Aparna V Prabhakar
732-603-9564
Aparna Prabhakar
217-243-2621, 217-245-8729, 312-946-0242
Aparna Prabhakar
914-218-8196
Aparna Prabhakar
732-390-5339
Aparna V Prabhakar
732-390-5339
Aparna R Prabhakar
858-481-1829

Publications

Us Patents

High Performance Compliant Wafer Test Probe

US Patent:
2012032, Dec 27, 2012
Filed:
Sep 10, 2012
Appl. No.:
13/608706
Inventors:
S. Jay Chey - Hartsdale NY, US
Dustin M. Fregeau - South Burlington VT, US
Aparna Prabhakar - North White Plains NY, US
Pavan Samudrala - White Plains NY, US
Mohammed S. Shaikh - Essex Junction VT, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
H05K 1/02
US Classification:
439 72
Abstract:
An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

Structure And Design Of Concentrator Solar Cell Assembly Receiver Substrate

US Patent:
2012013, Jun 7, 2012
Filed:
Sep 30, 2011
Appl. No.:
13/249686
Inventors:
Michael A. Gaynes - Vestal NY, US
Yves C. Martin - Ossining NY, US
Jay E. Pogemiller - New Paltz NY, US
Aparna Prabhakar - North White Plains NY, US
Theodore G. van Kessel - Millbrook NY, US
Brent A. Wacaser - Garrison NY, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
H01L 31/0232
H01L 31/024
US Classification:
136259
Abstract:
A substrate has a top side and a bottom side. A solar cell is secured to the top side of the substrate and has an anode and a cathode. A heat transfer element is secured to the bottom side of the substrate. An anode pad is formed on the top side of the substrate and is coupled to the anode of the solar cell; similarly, a cathode pad is formed on the top side of the substrate and is coupled to the cathode of the solar cell. The substrate coefficient of thermal expansion and the solar cell coefficient of thermal expansion match within plus or minus ten parts per million per degree C.

Ser Testing For An Ic Chip Using Hot Underfill

US Patent:
8288177, Oct 16, 2012
Filed:
Aug 17, 2010
Appl. No.:
12/857864
Inventors:
Michael Gaynes - Vestal NY, US
Michael S. Gordon - Yorktown Heights NY, US
Nancy C. LaBianca - Carmel CT, US
Kenneth F. Latzko - Carmel NY, US
Aparna Prabhakar - North White Plains NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
G01R 31/26
G01R 31/00
H01L 21/00
H01L 21/44
H01L 23/58
H01L 23/552
US Classification:
438 17, 438 26, 438108, 438613, 257 48, 257660, 257737, 257778, 257E21503, 257E21529, 257E23021, 257E23115, 324501, 32476202
Abstract:
A method for detecting soft errors in an integrated circuit (IC) due to transient-particle emission, the IC comprising at least one chip and a substrate includes mixing an epoxy with a radioactive source to form a hot underfill (HUF); underfilling the chip with the HUF; sealing the underfilled chip; measuring a radioactivity of the HUF at an edge of the chip; measuring the radioactivity of the HUF on a test coupon; testing the IC for soft errors by determining a current radioactivity of the HUF at the time of testing based on the measured radioactivity; and after the expiration of a radioactive decay period of the radioactive source, using the IC in a computing device by a user.

Laser Ablation Of Adhesive For Integrated Circuit Fabrication

US Patent:
2011029, Dec 1, 2011
Filed:
May 27, 2010
Appl. No.:
12/788839
Inventors:
Bing Dang - Chappaqua NY, US
Matthew Farinelli - Bronx NY, US
John Knickerbocker - Yorktown Heights NY, US
Aparna Prabhakar - North White Plains NY, US
Robert E. Trzcinski - Rhinebeck NY, US
Cornelia K. Tsang - Mohegan Lake NY, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
B32B 38/10
B29C 65/16
US Classification:
156247, 1563796
Abstract:
A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC), includes attaching the handler to the wafer using an adhesive comprising a thermoset polymer, the handler comprising a material that is transparent in a wavelength range of about 193 nanometers (nm) to about 400 nm; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer.

Electrochemical Liquid Cell Apparatus

US Patent:
2010027, Nov 4, 2010
Filed:
Apr 29, 2009
Appl. No.:
12/432037
Inventors:
S. Jay Chey - Ossining NY, US
Mark den Heijer - Dordrecht, NL
Aparna Prabhakar - White Plains NY, US
Frances M. Ross - Ossining NY, US
Ranjani Sirdeshmukh - Hastings on Hudson NY, US
International Classification:
C25B 9/06
US Classification:
204242
Abstract:
An electrochemical cell apparatus is disclosed where the cell has a chamber for containing an electrolyte. The chamber is situated between a bottom and a top substrate. One or more bottom windows are in the bottom substrate and one or more top windows are in the top substrate. Each window has a window cover facing the chamber. The top window and bottom window each have a portion in alignment so that an electron beam passes through both respective portions. A spacer is deposited between the top and bottom substrate and forming walls surrounding the chamber. Two or more electrodes, each having an interior portion that is within the chamber and electrically continuous with an exterior portion external to the chamber, are located on the chamber side of the bottom substrate.

Laser Ablation For Integrated Circuit Fabrication

US Patent:
8419895, Apr 16, 2013
Filed:
May 27, 2010
Appl. No.:
12/788843
Inventors:
Bing Dang - Chappaqua NY, US
John Knickerbocker - Yorktown Heights NY, US
Aparna Prabhakar - North White Plains NY, US
Peter Sorce - Poughkeepsie NY, US
Robert E. Trzcinski - Rhinebeck NY, US
Cornelia K. Tsang - Mohegan Lake NY, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
B32B 38/10
US Classification:
156703, 156712, 156753, 156930, 438976
Abstract:
A method for releasing a handler from a wafer, the wafer comprising an integrated circuit (IC) includes attaching the handler to the wafer using an adhesive comprising a polymer; performing edge processing to remove an excess portion of the adhesive from an edge of the handler and wafer; ablating the adhesive through the handler using a laser, wherein a wavelength of the laser is selected based on the transparency of the handler material; and separating the handler from the wafer. A system for releasing a handler from a wafer, the wafer comprising an IC includes a handler attached to a wafer using an adhesive comprising a polymer; an edge processing module, the edge processing module configured to remove an excess portion of the adhesive from the edge of the handler and wafer; and a laser, the laser configured to ablate the adhesive through the handler.

High Performance Compliant Wafer Test Probe

US Patent:
8487304, Jul 16, 2013
Filed:
Apr 30, 2010
Appl. No.:
12/771697
Inventors:
S. Jay Chey - Hartsdale NY, US
Dustin M. Fregeau - South Burlinton VT, US
Aparna Prabhakar - North White Plains NY, US
Pavan Samudrala - White Plains NY, US
Mohammed S. Shaikh - Essex Junction VT, US
Assignee:
International Business Machines Corporation - Armonk NY
International Classification:
H01L 23/58
H01L 23/48
H01L 23/52
US Classification:
257 48, 257750, 257758
Abstract:
An electrical connection includes a first electrical contact made of electrically conductive material. The first electrical contact is formed with a depression therein. Also included are a deformable pad, having a Young's modulus of less than 1,000,000 psi, which bears on the first contact; and a second electrical contact, made of electrically conductive material, which contacts the first electrical contact and is at least partially received into the depression. The deformable pad at least partially causes at least one lateral force on the first electrical contact, so as to induce the first electrical contact to make an electrical connection with the second electrical contact. An array of such contacts is also contemplated, as is an array of cantilevered contacts, which may or may not have depressions, and which are supported by at least one elastomeric pad, having a Young's modulus of less 72,500 psi.

Handler Attachment For Integrated Circuit Fabrication

US Patent:
2011029, Dec 1, 2011
Filed:
May 27, 2010
Appl. No.:
12/788832
Inventors:
Paul Andry - Yorktown Heights NY, US
Bing Dang - Chappaqua NY, US
John Knickerbocker - Yorktown Heights NY, US
Aparna Prabhakar - North White Plains NY, US
Peter Sorce - Poughkeepsie NY, US
Robert E. Trzcinski - Rhinebeck NY, US
Cornelia K. Tsang - Mohegan Lake NY, US
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION - Armonk NY
International Classification:
B32B 33/00
B29C 65/16
US Classification:
156 99, 1563796
Abstract:
A method for attaching a handler to a wafer, the wafer comprising an integrated circuit (IC), includes forming a layer of an adhesive on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280 C.; and adhering a handler to the wafer using the layer of adhesive. A system for attaching a handler to a wafer, the wafer comprising IC, includes a layer of an adhesive located on the wafer, the adhesive comprising a polyimide-based polymer configured to withstand processing at a temperature of over about 280 C.; and a handler adhered to the wafer using the layer of adhesive.

FAQ: Learn more about Aparna Prabhakar

Who is Aparna Prabhakar related to?

Known relatives of Aparna Prabhakar are: Rajneel Farley, Akila Prabhakar, Vivek Prabhakar, Anish Prabhakar, Ranjit Pamma. This information is based on available public records.

What are Aparna Prabhakar's alternative names?

Known alternative names for Aparna Prabhakar are: Rajneel Farley, Akila Prabhakar, Vivek Prabhakar, Anish Prabhakar, Ranjit Pamma. These can be aliases, maiden names, or nicknames.

What is Aparna Prabhakar's current residential address?

Aparna Prabhakar's current known residential address is: 279 E 44Th St, New York, NY 10017. Please note this is subject to privacy laws and may not be current.

What are the previous addresses of Aparna Prabhakar?

Previous addresses associated with Aparna Prabhakar include: 6 Langeland Dr, Mount Kisco, NY 10549; 18610 Cypress Haven Dr, Fort Myers, FL 33908; 155 Harbor, Chicago, IL 60601; 47 Peach Orchard Dr, East Brunswick, NJ 08816; 155 Harbor Dr, Chicago, IL 60601. Remember that this information might not be complete or up-to-date.

Where does Aparna Prabhakar live?

New York, NY is the place where Aparna Prabhakar currently lives.

How old is Aparna Prabhakar?

Aparna Prabhakar is 64 years old.

What is Aparna Prabhakar date of birth?

Aparna Prabhakar was born on 1960.

What is Aparna Prabhakar's email?

Aparna Prabhakar has such email addresses: lan***@gotpaintball.com, cor***@parsimail.com, aprabha***@yahoo.com. Note that the accuracy of these emails may vary and they are subject to privacy laws and restrictions.

What is Aparna Prabhakar's telephone number?

Aparna Prabhakar's known telephone numbers are: 914-218-8196, 312-946-0242, 732-390-5339, 858-481-1829, 732-603-9564, 217-243-2621. However, these numbers are subject to change and privacy restrictions.

How is Aparna Prabhakar also known?

Aparna Prabhakar is also known as: Aparn Prabhakar, Aparna Prabhaker. These names can be aliases, nicknames, or other names they have used.

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