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Binoy Shah

In the United States, there are 27 individuals named Binoy Shah spread across 21 states, with the largest populations residing in New Jersey, New York, Illinois. These Binoy Shah range in age from 34 to 55 years old. Some potential relatives include Rohit Shah, Trilok Sharma, Kamla Sharma. You can reach Binoy Shah through various email addresses, including vidhido***@gmail.com, ddel***@ix.netcom.com, trooper7***@hotmail.com. The associated phone number is 704-430-7882, along with 6 other potential numbers in the area codes corresponding to 516, 312, 440. For a comprehensive view, you can access contact details, phone numbers, addresses, emails, social media profiles, arrest records, photos, videos, public records, business records, resumes, CVs, work history, and related names to ensure you have all the information you need.

Public information about Binoy Shah

Resumes

Resumes

Chief Executive Officer

Binoy Shah Photo 1
Location:
Chicago, IL
Industry:
Luxury Goods & Jewelry
Work:
MaxMark, Inc. (a marketing arm of Asian Star Co.) - Chicago, IL since Apr 2011
CEO
Education:
The Ohio State University 1994 - 1998
Bachelors, Bachelor of Science In Business Administration, Computer Science
Skills:
Business Development, Management, Sales, Consulting, Entrepreneurship, Strategic Planning, Sourcing, Marketing, Product Management, Product Development, E Commerce, Manufacturing, Vendor Management, Business Intelligence, Business Strategy
Languages:
English

Business Owner

Binoy Shah Photo 2
Location:
Rahway, NJ
Industry:
Entertainment
Work:

Business Owner Mister East
Partner
Education:
William Paterson University of New Jersey 1997 - 2002

Binoy Shah

Binoy Shah Photo 3
Position:
Electronic Device Engineer at GE Global Research
Location:
Albany, New York Area
Industry:
Nanotechnology
Work:
GE Global Research since Oct 2009
Electronic Device Engineer Northwestern University Sep 2004 - Sep 2009
PhD Candidate - Mechanical Engineering GE Global Research Jun 2008 - Aug 2008
R&D Intern Intel Corporation May 2004 - Sep 2004
Microelectronic Packaging Engineer MIT Lincoln Laboratory May 2003 - Aug 2003
Engineering Research Intern Intel Corporation May 2002 - Aug 2002
Microelectronic Packaging Engineer Intel Corporation May 2001 - Aug 2001
Robotics Engineering Intern
Education:
Northwestern University 2004 - 2009
Carnegie Mellon University 1999 - 2004

Examiner

Binoy Shah Photo 4
Location:
Chicago, IL
Industry:
Mental Health Care
Work:
Chicago Public Schools
Examiner
Education:
Teachers College, Columbia University 2014 - 2016
Masters, Clinical Psychology Illinois Institute of Technology
Skills:
Clinical Psychology

Binoy Shah

Binoy Shah Photo 5
Location:
Dallas, TX
Work:
The University of Texas at Arlington Jun 2019 - May 2020
Graduate Teaching Assistant
Education:
The University of Texas at Arlington
Master of Science, Masters

Software Engineer

Binoy Shah Photo 6
Location:
Chicago, IL
Industry:
Computer Software
Work:
Infini Systems Jun 2014 - Jul 2014
Intern Olive Healthcare Limited Dec 2013 - Mar 2014
Intern Gatsby Labs Dec 2013 - Mar 2014
Software Engineer
Education:
Purdue University 2015 - 2019
Bachelor of Applied Science, Bachelors, Computer Engineering Dhirubhai Ambani International School 2003 - 2015
Purdue University
Bachelors, Bachelor of Science
Skills:
C, C++, Javascript, Html5, Css, Matlab, Microsoft Office, Arduino
Languages:
English
Hindi
French

Fellow In Spine Surgery

Binoy Shah Photo 7
Location:
New York, NY
Industry:
Hospital & Health Care
Work:
Mount Sinai Health System
Fellow In Spine Surgery Saifee Hospital Trust Oct 2015 - Jul 2016
Assistant Surgeon Bhatia Hospital Tardeo Oct 2015 - Jul 2016
Associate Consultant In Orthopaedic Surgery Orlando Health Aug 2014 - Jul 2015
Fellow In Paediatric Orthopaedics
Education:
K.j. Somaiyya Medical College and Research Centre 2004 - 2010
Bachelors, Bachelor of Medicine Harvard Medical School

Manufacturing Engineer

Binoy Shah Photo 8
Location:
Port Jefferson Station, NY
Industry:
Mechanical Or Industrial Engineering
Work:
Islandaire
Manufacturing Engineer
Background search with BeenVerified
Data provided by Veripages

Phones & Addresses

Name
Addresses
Phones
Binoy H Shah
440-845-0385, 440-884-5229
Binoy H Shah
440-845-0385, 440-884-5229
Binoy H Shah
440-263-4496
Binoy J Shah
704-274-5243
Binoy K Shah
571-333-5965
Binoy R Shah
212-573-8375

Publications

Us Patents

Vehicle Navigational System

US Patent:
2020005, Feb 20, 2020
Filed:
Oct 14, 2019
Appl. No.:
16/601067
Inventors:
- Schenectady NY, US
Chen-Po Chen - Niskayuna NY, US
Binoy M. Shah - Niskayuna NY, US
International Classification:
G02B 19/00
H01S 5/40
G02B 27/09
Abstract:
A lighting system for a navigational system of a vehicle includes a scanning unit and one or more lighting assemblies. Each lighting assembly includes one or more laser diodes configured to emit light, a lens array including one or more lens elements, and a controller electrically coupled with each of the laser diodes. The lens array receives incoming light from the laser diodes and direct the incoming light from the lens array as a collimated beam. The controller individually controls a power level of each of the laser diodes. The laser diodes, the lens array, and the controller are disposed on a substrate and disposed in a common housing. Each lighting assembly is arranged in an arc relative to the scanning unit. The scanning unit receives the collimated beam from each lighting assembly and directs the collimated beam from each lighting assembly in two orthogonal directions.

Semiconductor Device Interconnect

US Patent:
2013010, May 2, 2013
Filed:
Oct 28, 2011
Appl. No.:
13/284314
Inventors:
Raj BAHADUR - Niskayuna NY, US
David SHADDOCK - Niskayuna NY, US
Binoy SHAH - Niskayuna NY, US
Assignee:
GENERAL ELECTRIC COMPANY - Schenectady NY
International Classification:
H01L 23/48
H01L 21/28
US Classification:
257782, 438666, 257E2301, 257E21158
Abstract:
There is set forth herein a semiconductor assembly including an integrated circuit and a set of springs extending from the integrated circuit that can be adapted for connection to an external article. The external article can be e.g. an integrated circuit or a printed circuit board. On connection of the semiconductor assembly to an external article there can be defined a semiconductor assembly comprising the integrated circuit the set of springs and the external article. The set of springs can be metal nanospring array can formed by GLAD (Glancing angle deposition) process. In one embodiment, the nanospring array can be GLAD formed on a substrate and then applied to the integrated circuit. In one embodiment, the nanospring array can be GLAD formed on the integrated circuit.

Heat Transfer Device And An Associated Method Of Fabrication

US Patent:
2015006, Mar 5, 2015
Filed:
Sep 5, 2013
Appl. No.:
14/018579
Inventors:
- Schenectady NY, US
William Harold King - Scotia NY, US
Binoy Milan Shah - Schenectady NY, US
Tao Deng - Shanghai, CN
Assignee:
General Electric Company - Schenectady NY
International Classification:
F28D 15/04
B21D 53/02
US Classification:
16510426, 29890032
Abstract:
A heat transfer device includes a casing and a wick disposed within the casing. The wick includes a first sintered layer and a second sintered layer. The first sintered layer includes a plurality of first sintered particles, having a first porosity and a plurality of first pores. The first sintered layer is disposed proximate to an inner surface of the casing. The second sintered layer includes a plurality of second sintered particles, having a second porosity and a plurality of second pores. The second sintered layer is disposed on the first sintered layer. The heat transfer device includes at least one first sintered particle smaller than at least one second pore and the first porosity is smaller than the second porosity.

Fine-Pitch Flexible Wiring

US Patent:
2013031, Dec 5, 2013
Filed:
May 31, 2012
Appl. No.:
13/485526
Inventors:
James Wilson Rose - Guilderland NY, US
Kaustubh Ravindra Nagarkar - Clifton Park NY, US
Craig Patrick Galligan - Niskayuna NY, US
Binoy Milan Shah - Schenectady NY, US
Oliver Richard Astley - Clifton Park NY, US
Assignee:
GENERAL ELECTRIC COMPANY - Schenectady NY
International Classification:
H02G 15/02
H01B 13/00
US Classification:
174 74 R, 156 47
Abstract:
A flexible wire assembly includes a plurality of elongated conductors and insulators each having a quadrilateral cross section and alternatingly laminated together, the flexible wire assembly having a wire width measured across the conductor and insulators, a wire height equivalent to the height of the conductors and insulators, and a wire length which is measured in a longitudinal direction orthogonal to the wire width and the wire height, wherein the wire length is one or more orders of magnitude greater than the wire width and the wire height; and a first device comprising a plurality of bond pads spaced to define a bond pad pitch, wherein the flexible wire assembly is coupled to the first device at the bond pads such that spacing of the conductor conductors is matched to the bond pad pitch.

System Including Thermal Interface Material

US Patent:
2013022, Aug 29, 2013
Filed:
Feb 29, 2012
Appl. No.:
13/408305
Inventors:
Tao Deng - Clifton Park NY, US
Yogen Vishwas Utturkar - Niskayuna NY, US
Binoy Milan Shah - Schenectady NY, US
Pramod Chamarthy - Niskayuna NY, US
Assignee:
GENERAL ELECTRIC COMPANY - Schenectady NY
International Classification:
B32B 15/01
B29C 65/48
US Classification:
428576, 156498
Abstract:
A system for heat transfer along with the method of preparation of the same is described. System includes a first surface, a second surface, and an interface material. The interface material is disposed between the first and second surfaces such that it is solid at an assembling temperature and liquid at an operating temperature. The first surface of the system is configured to adhere to the solid and liquid thermal interface material, and the second surface is configured to adhere to the liquid thermal interface material and be detachable from the solid interface material. The method of preparation of the system includes disposing the first surface, an interface material, and a second surface, heating the interface material to above its melting point and then cooling to a temperature below melting point to detach and remove the second surface from the interface material.

Reusable Phase-Change Thermal Interface Structures

US Patent:
2015016, Jun 18, 2015
Filed:
Dec 12, 2013
Appl. No.:
14/103868
Inventors:
- Schenectady NY, US
Graham Charles Kirk - Milton Keynes, GB
Jay Todd Labhart - Cary NC, US
Binoy Milan Shah - Queensbury NY, US
Yogen Vishwas Utturkar - Niskayuna NY, US
Pramod Charmarthy - Revere MA, US
Tao Deng - Shanghai, CN
Assignee:
General Electric Company - Schenectady NY
International Classification:
F28F 21/08
H05K 1/02
Abstract:
A reusable phase-change thermal interface structure having a metal based foam and a fusible metal based alloy is provided. In a solid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least in a portion of the metal based foam. Further, in a liquid phase of the fusible metal based alloy the fusible metal based alloy is disposed at least on a portion of one or more outer surfaces of the metal based foam.

Flexible Metallic Heat Connector

US Patent:
2013020, Aug 15, 2013
Filed:
Jan 25, 2013
Appl. No.:
13/750078
Inventors:
GENERAL ELECTRIC COMPANY - , US
Stuart Connolly - Towcester, GB
Tao Deng - Niskayuna NY, US
Zeshan Jabar Hussain - Towcester, GB
Binoy Milan Shah - Niskayuna NY, US
Assignee:
GENERAL ELECTRIC COMPANY - Schenectady NY
International Classification:
F28F 7/00
B23P 15/26
US Classification:
165 84, 2989003
Abstract:
A thermal connector configured to be placed within a recess of a heat sink between the heat sink and a heat generating component and transfer heat from the component to the heat sink, including a heat spreader configured to fit within the recess of the heat sink, a spring configured to sit between the heat spreader and with the heat sink and bias the heat spreader towards and away from the heat sink, a flexible membrane attached to the heat sink and the heat spreader and seal off the recess, and a phase change material that fills the recess, wherein the flexible membrane contains the phase change material and allows it to contract or expand in response to the movement of the heat spreader towards or away from the heat sink.

Circuit Card Assembly And Method Of Manufacturing Thereof

US Patent:
2016009, Mar 31, 2016
Filed:
Sep 29, 2014
Appl. No.:
14/500530
Inventors:
- Schenectady NY, US
Stuart Connolly - Northampton, GB
Binoy Milan Shah - Niskayuna NY, US
Brian Hoden - Huntsville AL, US
Joo Han Kim - Niskayuna NY, US
International Classification:
H05K 1/02
H05K 3/36
H05K 3/30
H05K 7/20
H05K 1/18
Abstract:
A circuit card assembly is provided. The assembly includes a first printed circuit board, at least one electronic component mounted on the first printed circuit board at a predetermined location, a frame coupled to the first printed circuit board, and a heat transfer assembly coupled to the frame. The heat transfer assembly includes a first plate extending over at least a portion of the first printed circuit board, a heat pipe coupled to the first plate, and a thermally conductive member positioned between the at least one electronic component and the heat pipe. The thermally conductive member is selectively mounted at predetermined locations along the first plate based on the predetermined location of the at least one electronic component.

FAQ: Learn more about Binoy Shah

Where does Binoy Shah live?

Schenectady, NY is the place where Binoy Shah currently lives.

How old is Binoy Shah?

Binoy Shah is 42 years old.

What is Binoy Shah date of birth?

Binoy Shah was born on 1981.

What is Binoy Shah's email?

Binoy Shah has such email addresses: vidhido***@gmail.com, ddel***@ix.netcom.com, trooper7***@hotmail.com, bis***@aol.com, bsha***@aol.com, amy.coll***@rochester.rr.com. Note that the accuracy of these emails may vary and they are subject to privacy laws and restrictions.

What is Binoy Shah's telephone number?

Binoy Shah's known telephone numbers are: 704-430-7882, 516-997-9458, 312-282-7209, 440-263-4496, 703-968-0267, 312-404-0491. However, these numbers are subject to change and privacy restrictions.

How is Binoy Shah also known?

Binoy Shah is also known as: Binoy Shah, Binoy K Shah, Biloy M Shah, Adity M Shah, Shah Binoy. These names can be aliases, nicknames, or other names they have used.

Who is Binoy Shah related to?

Known relatives of Binoy Shah are: Kamla Sharma, Trilok Sharma, Usha Sharma, Dinesh Shah, Divya Shah, Aditi Shah, Kushan Shah, Mehul Shah, Rohit Shah, Vijaykumar Shah, Bhumi Shah, Shakuntalaben Shah, Sharma Surinder. This information is based on available public records.

What are Binoy Shah's alternative names?

Known alternative names for Binoy Shah are: Kamla Sharma, Trilok Sharma, Usha Sharma, Dinesh Shah, Divya Shah, Aditi Shah, Kushan Shah, Mehul Shah, Rohit Shah, Vijaykumar Shah, Bhumi Shah, Shakuntalaben Shah, Sharma Surinder. These can be aliases, maiden names, or nicknames.

What is Binoy Shah's current residential address?

Binoy Shah's current known residential address is: 1455 Dorwaldt Blvd Apt 3-15, Schenectady, NY 12308. Please note this is subject to privacy laws and may not be current.

What are the previous addresses of Binoy Shah?

Previous addresses associated with Binoy Shah include: 658 Bryant St, Westbury, NY 11590; 1327 Harbor Park Dr, Memphis, TN 38103; 206 Hidden Hollow Ct, Edison, NJ 08820; 25117 Sweet Myrtle Sq, Aldie, VA 20105; 450 E Waterside Dr # Dr2908, Chicago, IL 60601. Remember that this information might not be complete or up-to-date.

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