Ashit Mehta

7 individuals named Ashit Mehta found in 11 states. Most people reside in New York, Texas, North Carolina.

Ages	34 to 64
Phones	773-743-2889	919-380-7699	919-481-0143
Addresses	2531 W Howard St Apt A, Chicago, IL 60645	115 White Sands Dr, Cary, NC 27513	1224 Tartarian Trl, Apex, NC 27502
Business records	Epmo - Digital Analytics / Metlife

Last updated Jan 24, 2024

Public information about Ashit Mehta

Phones & Addresses

Name

Addresses

Phones

Ashit M Mehta

4111 Westcity Ct, El Paso, TX 79902

915-532-6895, 915-533-5045

Ashit M Mehta

9503 Joyce Ln, Littleton, CO 80126

Ashit A Mehta

200 Foliage Cir, Cary, NC 27518

919-481-0143

Ashit M Mehta

9009 Symmes Rd, Gibsonton, FL 33534

Ashit M Mehta

508 Bergen St, Trenton, NJ 08648

210-767-9449

Ashit A Mehta

220 Old Pros Way, Cary, NC 27560

919-380-7699, 919-481-0143

Ashit M Mehta

63 Marvin Ave, East Millstone, NJ 08873

210-767-9449

Ashit M Mehta

92 Tonnele Ave #4, Jersey City, NJ 07306

210-767-9449

Publications

Us Patents

Fluorinated Carbon Polymer Composites

US Patent:

5556899, Sep 17, 1996

Filed:

Nov 30, 1994

Appl. No.:

8/346766

Inventors:

Bodil E. Braren - Hartsdale NY
Shahrokh Daijavad - Peekskill NY
Elizabeth Foster - Friendsville PA
James L. Hedrick - Oakland CA
Jeffrey C. Hedrick - Peekskill NY
Rodney T. Hodgson - Ossining NY
Ashit A. Mehta - Vestal NY
Steven E. Molis - Brewster NY
Jane M. Shaw - Ridgefield CT
Stephen L. Tisdale - Vestal NY
Alfred Viehbeck - Fishkill NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

C08J 518

US Classification:

523215

Abstract:

Disclosed is a process of effecting a change in the dielectric constant and coefficient of thermal expansion of a polyimide material, by forming a composite based on a dispersion of 2-60 wt. % of fluorinated particulate carbon material and a polyimide or polyimide precursor, and heating the dispersion to about 400. degree. C. at 65. degree. -200. degree. C. /second.

Thermally Stable Photoimaging Composition

US Patent:

5667934, Sep 16, 1997

Filed:

Oct 9, 1990

Appl. No.:

7/594780

Inventors:

Voya Rista Markovich - Endwell NY
Ashit Arvind Mehta - Vestal NY
Eugene Roman Skarvinko - Binghamton NY
David Wei Wang - Vestal NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G03C 1725

US Classification:

4302801

Abstract:

A thermally stable photoimaging composition and a method of using the same, especially on circuit boards as a solder mask is provided. The composition includes a polymerizable resin or resin system, a cationic photoinitiator, a solvent, and an optically transparent ceramic filler. Preferably, the composition has a coefficient of thermal expansion of about 28-40 ppm/. degree. C. , which closely matches the coefficient of thermal expansion of the solder used on the circuit board components.

Method For Fabricating Metal Core Layers For A Multi-Layer Circuit Board

US Patent:

5153986, Oct 13, 1992

Filed:

Jul 17, 1991

Appl. No.:

7/731598

Inventors:

John M. Brauer - Binghamton NY
Frederick R. Christie - Endicott NY
William H. Lawrence - Greene NY
Ashit A. Mehta - Vestal NY
Jonathan D. Reid - Johnson City NY
William J. Summa - Endwell NY

Assignee:

International Business Machines - Armonk NY

International Classification:

H05K 302

US Classification:

29846

Abstract:

Disclosed is a method of fabricating a multilayer electronic circuit package. The multilayer circuit package has at least one layer that is a circuitized, polymer encapsulated metal core. According to the method of the invention a metal foil is provided for the metal core of the layer. This metal core foil may be provided as a single unit or in a continuous, roll to roll, process. The vias and through holes are drilled, etched, or punched through the metal foil. An adhesion promoter is then applied to the perforate metal foil for subsequent adhesion of polymer to the foil. The dielectric polymer is then applied to the perforate metal foil core by vapor depositing, chemical vapor depositing, spraying or electrophoretically depositing, a thermally processable dielectric polymer or precursor thereof onto exposed surfaces of the perforate metal foil including the walls of the through holes and vias. The dielectric polymer or precursor thereof is then thermally processed to form a conformal dielectric, polymeric coating on surfaces of the perforate metal foil, including the interior surfaces of the vias and through holes. This dielectric, polymeric coating may then be circuitized, and coated with an adhesive for lamination to the next adjacent layer.

Triazine Thin Film Adhesives

US Patent:

5319244, Jun 7, 1994

Filed:

Dec 13, 1991

Appl. No.:

7/806410

Inventors:

Konstantinos I. Papathomas - Endicott NY
David W. Wang - Vestal NY
William J. Summa - Endwell NY
Ashit A. Mehta - Vestal NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B32B 300

US Classification:

257701

Abstract:

Disclosed are thin film triazine adhesives on organic carriers, method for making them and microelectronic circuit packages incorporating them. The circuit package has a substrate made up of organic, dielectric, polymeric sheets. At least one pair of the polymeric sheets face each other and are adhesively joined together by a triazine polymer.

Coated Filler And Use Thereof

US Patent:

5607744, Mar 4, 1997

Filed:

Jul 11, 1994

Appl. No.:

8/272658

Inventors:

Carl E. Diener - Binghamton NY
Ashit A. Mehta - Vestal NY
Ralph S. Paonessa - Endwell NY
Eugene R. Skarvinko - Binghamton NY
David W. Wang - Vestal NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B32B 310
B32B 1508
B32B 2730

US Classification:

428131

Abstract:

Fillers coated with a fluorosilane coating are provided as well as compositions containing the coated fillers. Compositions are especially suitable for substrates for printed circuit boards and cards.

Fluorinated Carbon Polymer Composites

US Patent:

5591285, Jan 7, 1997

Filed:

Jul 24, 1995

Appl. No.:

8/475670

Inventors:

Assignee:

International Business Machines Corp. - Armonk NY

International Classification:

B32B 3128
B32B 2716

US Classification:

156 622

Abstract:

Disclosed are structures comprising a composite of fluorinated particulate carbon dispersed in a polymer, the fluorinated carbon being present in an amount sufficient to reduce the dielectric constant of the composition, the structure also including electrical conductor patterns. The composite can be made conductive by irradiating it with an UV excimer laser.

Thermally Stable Photoimaging Composition

US Patent:

5665526, Sep 9, 1997

Filed:

Jun 6, 1995

Appl. No.:

8/471644

Inventors:

Voya Rista Markovich - Endwell NY
Ashit Arvind Mehta - Vestal NY
Eugene Roman Skarvinko - Binghamton NY
David Wei Wang - Vestal NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

G03C 500
C08F 246

US Classification:

430325

Abstract:

Fluorinated Polymeric Composition, Fabrication Thereof And Use Thereof

US Patent:

5055342, Oct 8, 1991

Filed:

Feb 16, 1990

Appl. No.:

7/484173

Inventors:

Voya Markovich - Endwell NY
Ashit Mehta - Vestal NY
Jae M. Park - Somers NY
Eugene Skarvinko - Binghamton NY
David W. Wang - Vestal NY

Assignee:

International Business Machines Corporation - Armonk NY

International Classification:

B32B 300

US Classification:

428137

Abstract:

Fluorinated polymeric composition exhibiting low dielectric constant and a low coefficient of thermal expansion containing a fluorinated polymeric material and a silica and/or quartz filler having a mean particle size of no greater than 7 microns, and use thereof to form a substrate having vias therein. Layers of the above composition are obtained by applying the composition to a substrate and then heating the composition to a temperature sufficient to cause the composition to fuse.

Videos & Images

FAQ: Learn more about Ashit Mehta

What is Ashit Mehta date of birth?

Ashit Mehta was born on 1960.

What is Ashit Mehta's telephone number?

Ashit Mehta's known telephone numbers are: 773-743-2889, 919-380-7699, 919-481-0143, 607-380-7699, 210-694-5995, 915-532-6895. However, these numbers are subject to change and privacy restrictions.

How is Ashit Mehta also known?

Ashit Mehta is also known as: Ashit S Mehta, Asha Mehta, Ashita Mehta, Ash A Mehta, Ash L Mehta, Ashiti A Mehta, Ashit Meh, Mehta Ash, Arvind M Ashit. These names can be aliases, nicknames, or other names they have used.

Who is Ashit Mehta related to?

Known relatives of Ashit Mehta are: Deborah Watts, Randall Watts, Brandon Watts, Sandeep Mehta, Frank Merendino, Cal Merendino. This information is based on available public records.

What are Ashit Mehta's alternative names?

Known alternative names for Ashit Mehta are: Deborah Watts, Randall Watts, Brandon Watts, Sandeep Mehta, Frank Merendino, Cal Merendino. These can be aliases, maiden names, or nicknames.

What is Ashit Mehta's current residential address?

Ashit Mehta's current known residential address is: 115 White Sands Dr, Cary, NC 27513. Please note this is subject to privacy laws and may not be current.

What are the previous addresses of Ashit Mehta?

Previous addresses associated with Ashit Mehta include: 115 White Sands Dr, Cary, NC 27513; 1224 Tartarian Trl, Apex, NC 27502; 200 Foliage Cir, Cary, NC 27518; 220 Old Pros Way, Morrisville, NC 27560; 500 Golden Horseshoe Cir #F, Morrisville, NC 27560. Remember that this information might not be complete or up-to-date.

Where does Ashit Mehta live?

Cary, NC is the place where Ashit Mehta currently lives.

How old is Ashit Mehta?

Ashit Mehta is 64 years old.

What is Ashit Mehta date of birth?

Ashit Mehta was born on 1960.

Possible Relatives

David Mehta Cyrus Mehta Daxa Mehta Daksha Mehta Aakash Mehta Deepa Mehta Deepak Mehta Ashit Patel Ashit Shah Chris Melito

Ashit Mehta

Information related to people with name Ashit Mehta

Public information about Ashit Mehta

Phones & Addresses

Publications

Us Patents

Fluorinated Carbon Polymer Composites

Thermally Stable Photoimaging Composition

Method For Fabricating Metal Core Layers For A Multi-Layer Circuit Board

Triazine Thin Film Adhesives

Coated Filler And Use Thereof

Fluorinated Carbon Polymer Composites

Thermally Stable Photoimaging Composition

Fluorinated Polymeric Composition, Fabrication Thereof And Use Thereof

FAQ: Learn more about Ashit Mehta

Possible Relatives